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US 2021/0232887 A1Published application
Method of filling a slit in a metallic smartcard
AssigneeWhitewater Solutions Corp.
InventorJohn RITTER
Life of this patent
Estimating the term…
Abstract
A method for filling a through slit in a metal layer for use in a metallic smartcard by providing a metal sheet having at least one through slit extending through the thickness of the metal sheet, applying a polymer resin to the metal sheet so as to substantially fill the slit(s), and curing the resin. A coupling frame for a smartcard, and a smartcard are also provided.
Claims12
A method for filling a through slit in a metal layer for use in a metallic smartcard, comprising the steps of:
- (a) providing a metal sheet having at least one through slit extending through the thickness of the metal sheet;
- (b) applying an electrically insulating polymer resin to the metal sheet so as to substantially fill the at least one slit;
- and
- (c) curing said resin.
1 more element
A coupling frame for a smartcard, comprising:
- (a) a metal layer having an opening or recess for receiving a transponder chip module;
- (b) a slit extending from the opening or recess to an outer edge of the metal layer;
- and
- (c) a urethane resin that fills said slit.
1 more element
Dependencies are inferred from the claim text.