Method and apparatus for mitigating adverse effects of bonding wire of external optical modulators
AssigneesOe Solutions America, Inc., Oe Solutions Co., Ltd.
InventorsMoon Soo PARK, Tae Young JEON
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Abstract
An optical transceiver including a submount, a Mach-Zehnder Modulator (MZM), bonding wires, and a low pass filter type matching network is provided. The MZM includes an input port and an output port and disposed on the submount. The bonding wires are coupled to the submount and the MZM. The low pass filter type matching network is coupled to the bonding wires and is configured to absorb inductance of the bonding wires at a high frequency.
Claims15
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A method of using a low pass filter (LPF) type matching network configured to absorb inductance of bonding wires at a high frequency between an external optical modulator and a submount in a packaging of the external optical modulator.
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