Flooring underlayment system
AssigneeWise Manufacturing, Inc.
InventorRonald Wise
Life of this patent
Estimating the term…
Abstract
A system for underlayment of a flooring has at least two foam panels having and a complementary under step portion on one side an an overstep portion on an opposite side. The understep portion has an adhesive strip with a release liner. The panels are joined by placing the overstep portion of one panel over the understep portion of an adjacent panel and removing the release liner. The overstep portion is then adhered to the overstep portion to seal the panels together. A method of grinding foam strips to form the panels is disclosed.
Claims11
A system for underlayment of flooring on a subfloor, the system comprising:
- at least two foam panels each of the foam panels having a top surface adapted to be placed under the flooring and a bottom surface adapted to be placed on the subfloor, each of the panels further having a pair sides, one of the pair of sides having an understep surface extending between an upper edge portion and a lower edge portion, the understep surface is spaced apart and parallel to the top surface;
- another side of the par of panels having an overstep surface extending between an upper edge portion and a lower edge portion, the overstep surface is spaced apart and parallel to the top surface.
A method of forming a foam panel for an underlayment system comprising:
- removing a top surface at one edge of foam strip with a cutting wheel to remove a portion of the top surface to form an under step having a predetermined depth and width;
- and
- removing a bottom surface at an opposite edge of the strip to form an overstep portion having a predetermined width and depth applying an adhesive to either the understep surface or the overstep.
Dependencies are inferred from the claim text.