Film Forming Method

A method of forming a film comprising:

• rotating, inside a vacuum chamber, a to-be-processed substrate with a center of the to-be-processed substratre serving as a center of turning, while revolving the to-be-processed substrate on a same plane about a revolution shaft;
• feeding a film-forming material from a film-forming source to form a predetermined thin film on a surface of the to-be-processed substrate, the film-forming source being disposed at a predetermined position inside the vacuum chamber in a manner to lie opposite to the rotated and revolved to-be-processed substrate;
• provided that a goal film thickness of the thin film to be formed be defined as T, and that a film thickness of the thin film to be formed on the to-be-processed substrate in one revolution period be defined as D, the method further comprising a setting process for setting a ratio α of rotation angular velocity to a revolution angular velocity of the to-be-processed substrate to a value satisfying the following formula (1) (excluding a case amounting to an integral multiple and a half-integral multiple)
• α≥6/log10(T/D) (1).