Vacuum deposition facility and method for coating a substrate

A method for continuously depositing, on a running substrate, coatings formed from at least one metal inside a vacuum deposition facility including a vacuum chamber, the method comprising the steps of:

• ejecting, in the vacuum chamber, a metallic vapor through at least two vapor ejectors, towards both sides of the running substrate, a layer of at least one metal being formed on each of the both sides by condensation of ejected vapors, the at least two vapor ejectors facing each other being located on the both sides of the substrate and being positioned respectively with an angle α and α′ between the respective vapor ejector and a axis perpendicular to a running direction of the running substrate, the axis being in the plane of the substrate, α and α′ both satisfying the following equations:
• (D1+D2)+Le sin α+We cos α=Ws and
• (D1+D2)+Le sin α′+We cos α′=Ws
• α and α′ in absolute value being above 0° and D1 and D2 being defined as a distance between the respective ejector edges and substrate edges along the axis, Ws being the substrate width, D1 and D2 being above 0 mm so the respective ejector edges do not extend beyond the respective substrate edges, the vapor ejectors having an elongated shape and including a slot defined by a slot length Le and a slot width We, the vapor ejectors having a same rotation axis.