Cu ALLOY TARGET
AssigneeUlvac, Inc.
InventorSatoru TAKASAWA
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Abstract
There is provided a Cu alloy target including a Cap film alloy. In a case where the number of atoms of the Cap film alloy is 100 at %, when the Cap film alloy contains Cu of more than 50 at % and Al of 0.5 at % or more, the Cap film alloy contains an additive metal containing at least one metal material selected from the group consisting of Mg of 0.5 at % or more, Si of 0.5 at % or more, and Ni of 3 at % or more, or contains Ca of 0.5 at % or more as the additive metal. Adhesion between a Cap film and a Si oxide thin film formed on the Cap film by a CVD method is strong, and removal does not occur.
Claims2
A Cu alloy target including a Cap film alloy, wherein, when the number of atoms of the Cap film alloy is 100 at %, the Cap film alloy comprises:
- Cu:
- more than 50 at %
- an additive metal comprising Si:
- 0.5 at % or more and less than 15 at %:
- and
- Al:
- 0.5 at % or more.
2-5. (canceled)
Dependencies are inferred from the claim text.