Thermoplastic Resin Film, Meltable Bag, and Packaged Hot-Melt Adhesive

Abstract

There are provided a thermoplastic resin film suitable for forming a meltable bag for packaging a hot-melt adhesive, the thermoplastic resin film having a high melting rate and high bag breakage resistance because adhesion between thermoplastic resin films is suppressed when packaged hot-melt adhesives are stored in a stacked manner and thus the breakage of the meltable bags is suppressed when the meltable bags are peeled apart, a meltable bag formed of the thermoplastic resin film, and a packaged hot-melt adhesive. A thermoplastic resin film contains at least one resin selected from the group consisting of a polyethylene resin and an ethylene-based copolymer, wherein (1) the film has at least one embossed surface, and the at least one embossed surface has a ten point height of irregularities Rzjis of 10 to 200 μm, (2) the film has a melting point of 60° C. to 120° C., and (3) an elastic modulus in a TD direction and an elastic modulus in an MD direction are both 15 MPa or more.

Dependencies are inferred from the claim text.