Improvements to step back height
AssigneeXyztec B.V.
InventorsArjen Hoeflaak, Cornelis Bartholomeus Maria Van Mil, Robert John Sykes
Life of this patent
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Abstract
A bond tester apparatus arranged for determining a strength of a bond and/or a material present on a base, said bond tester apparatus comprising a force measurement module for applying a shear force to said bond and/or said material, and a displacement module and a controller arranged for controlling the distance between the force measurement module and the displacement module such that the shear height of a shear tool can be set.
Claims9
1-8. (canceled)
A bond tester apparatus configured for determining a strength of a bond and/or a material present on a base, the bond tester apparatus comprising:
- a force measurement module comprising a shear tool configured to apply a shear force to the bond and/or the material;
- a displacement module, comprising:
- a movable rigid body;
- a movable member configured to movably connect the force measurement module to the displacement module thereby providing a displacement distance between the rigid body and the force measurement module;
- and
- a displacement sensor configured to measure the displacement distance;
- and
- a controller configured to:
- monitor the measured displacement distance;
- move the rigid body, and thereby also the force measurement module, towards the base until the shear tool comes in contact with the base to obtain a contact displacement distance;
- control the displacement module to clamp the force measurement module to the displacement module such that a distance between the base and the shear tool is the contact displacement distance;
- and
- move the rigid body, and thereby also the force measurement module, to set a shear height of the shear tool, based on the contact displacement distance.
A method for determining a strength of a bond and/or a material present on a base using a bond tester apparatus comprising:
- a force measurement module comprising a shear tool configured to apply a shear force to the bond and/or the material;
- a displacement module, comprising:
- a movable rigid body;
- a movable member configured to movably connect the force measurement module to the displacement module to provide a displacement distance between the rigid body and the force measurement module;
- and
- a displacement sensor configured to measure the displacement distance;
- and
- a controller configured to:
- monitor the measured displacement distance;
- move the rigid body, and thereby also the force measurement module, towards the base until the shear tool comes in contact with the base to obtain a contact displacement distance;
- control the displacement module to clamp the force measurement module to the displacement module such that a distance between the base and the shear tool is the contact displacement distance;
- and
- move the rigid body, and thereby also the force measurement module, to set a shear height of the shear tool, based on the contact displacement distance;
- wherein the method comprises the steps of:
- monitoring, by the controller, the measured displacement distance;
- moving, by the controller, the rigid body, and thereby also the force measurement module, downwards until the shear tool comes in contact with the base thereby obtaining a contact displacement distance;
- controlling, by the controller, the displacement member to clamp the force measurement module to the displacement module such that a distance between the base and the shear tool is the contact displacement distance;
- and
- moving, by the controller, the rigid body, and thereby also the force measurement module, to set a shear height of the shear tool, based on the contact displacement distance.
Dependencies are inferred from the claim text.