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US 2021/0229306 A1Published application
Cutting apparatus and cutting method
AssigneeDisco Corporation
InventorsSatoshi HANAJIMA, Jun NAKAMA
Life of this patent
Estimating the term…
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AssigneeDisco Corporation
InventorsSatoshi HANAJIMA, Jun NAKAMA
Estimating the term…
A cutting apparatus includes a holding table that has at at least a part of a holding surface a transparent section including a transparent member and that holds a workpiece, a cutting unit including a cutting blade that cuts the workpiece held by the holding table, and a cutting water nozzle that supplies cutting water during cutting of the workpiece by the cutting blade, an imaging camera that images the workpiece through the transparent section, and a removing unit that removes a liquid adhered to the transparent section. The removing unit includes a contact member positioned at a contact position for making contact with the transparent section and a retracted position, and an X-axis moving unit that relatively moves on the transparent section the contact member making contact with the transparent section.
A cutting apparatus comprising:
A cutting method for processing a workpiece by a cutting apparatus, the cutting apparatus including a holding table that has at at least a part of a holding surface a transparent section including a transparent member and that holds the workpiece, a cutting unit including a cutting blade that cuts the workpiece held by the holding table, and a cutting water nozzle that supplies cutting water during cutting of the workpiece by the cutting blade, an imaging camera that images the workpiece through the transparent section, and a removing unit that removes a liquid adhered to the transparent section, the cutting method comprising:
Dependencies are inferred from the claim text.