Porous polyurethane polishing pad and process for preparing the same
AssigneeSKC solmics Co., Ltd.
InventorsJang Won SEO, Hyuk Hee HAN, Hye Young HEO, Joonsung RYOU, Young Pil KWON
Life of this patent
Estimating the term…
Abstract
Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization and a process for preparing the same. It is possible to control the size and distribution of pores in the porous polyurethane polishing pad by using thermally expanded microcapsules and an inert gas as a gas phase foaming agent, whereby the polishing performance thereof can be adjusted.
Claims15
A porous polyurethane polishing pad, which comprises a polyurethane resin and pores distributed in the polyurethane resin,
- wherein, in a distribution diagram of the sum of the cross-sectional areas of pores by the pore size, the pore size at the maximum peak is in the range of 18 μm to 28 μm or in the range of 50 μm to 65 μm.
A process for preparing a porous polyurethane polishing pad, which comprises:
- injecting an inert gas when a urethane-based prepolymer, a curing agent, a solid phase foaming agent, a reaction rate controlling agent, and a silicone-based surfactant are mixed to mold the mixture while pores are formed, wherein the solid phase foaming agent is employed in an amount of 1 part by weight to 3 parts by weight based on 100 parts by weight of the urethane-based prepolymer, and
- wherein, in a distribution diagram of the sum of the cross-sectional areas of pores by the pore size, the pore size at the maximum peak is in the range of 18 μm to 28 μm or in the range of 50 μm to 65 μm.
Dependencies are inferred from the claim text.