Substrate polishing apparatus, substrate polishing method, and apparatus for regulating temperature of polishing surface of polishing pad used in polishing apparatus

A polishing apparatus which polishes a substrate, comprising:

• a rotatable polishing table which supports a polishing pad;
• a top ring for pressing the substrate against a surface of the polishing pad to polish the substrate;
• and
• a pad-temperature regulator for regulating a temperature of the surface of the polishing pad,
• wherein the pad-temperature regulator includes:
• a heater for heating the surface of the polishing pad;
• and
• a cooler for cooling the surface of the polishing pad;
• and
• wherein the heater and the cooler are located upstream of the top ring with respect to a rotational direction of the polishing table.

A polishing apparatus which polishes a substrate, comprising:

• a rotatable polishing table which supports a polishing pad;
• a top ring for pressing the substrate against a surface of the polishing pad to polish the substrate;
• and
• a pad-temperature regulator for regulating a temperature of the surface of the polishing pad,
• wherein the pad-temperature regulator includes:
• a heating mechanism for heating the surface of the polishing pad;
• and
• a cooling mechanism for cooling the surface of the polishing pad;
• and
• wherein the heating mechanism and the cooling mechanism are located upstream of the top ring with respect to a rotational direction of the polishing table.

A polishing method, comprising:

• rotating a polishing table which supports a polishing pad;
• and
• pressing a substrate held by a top ring against a surface of the polishing pad while regulating a temperature of the surface of the polishing pad by use of a pad-temperature regulator to thereby polish the substrate,
• wherein the pad-temperature regulator includes:
• a heater for heating the surface of the polishing pad;
• and
• a cooler for cooling the surface of the polishing pad;
• and
• wherein the heater and the cooler are located upstream of the top ring with respect to a rotational direction of the polishing table.

A polishing method, comprising:

• rotating a polishing table which supports a polishing pad;
• supplying a heating fluid onto a polishing surface of the polishing pad to heat the polishing surface and/or supplying a cooling fluid onto the polishing surface of the polishing pad to cool the polishing surface;
• after supplying of the heating fluid and/or the cooling fluid, pressing an object to be polished against the polishing surface;
• performing a relative movement of the object to be polished and the polishing pad;
• and
• during the relative movement, performing a heating and a cooling of the polishing pad.