Plated metal bonding method and plated metal bonding apparatus
AssigneeUltex Corporation
InventorShigeru Sato
Life of this patent
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Abstract
A stable bonding processing for metal, of which at least a part is plated, is provided. A plated metal bonding apparatus performs bonding of a first metal and a second metal. At least one from among the first metal and the second metal has a plated bonding portion where the bonding processing is to be performed. A bonding processing unit performs bonding of the first metal and the second metal using sound vibration and/or ultrasound vibration. The bonding processing unit performs the bonding processing using a plated material or otherwise using a metal portion in a state in which a plating material has been removed.
Claims8
A plated metal bonding method for bonding a plurality of metals, comprising bonding in which a bonding processing unit bonds a plurality of metals using sound vibration and/or ultrasound vibration,
- wherein a part of or all the plurality of metals have a plated bonding portion where bonding is to be performed,
- and wherein, in the bonding, the bonding processing unit performs bonding using at least a part of a plating material and/or performs bonding using a metal portion in a state in which at least a part of the plating material is removed.
A plated metal bonding apparatus configured to support bonding of a plurality of metals, the plated metal bonding apparatus comprising a bonding processing unit configured to perform bonding of a plurality of metals using sound vibration and/or ultrasound vibration,
- wherein a part of or all the plurality of metals have a plated bonding portion where bonding is to be performed,
- and wherein the bonding processing unit performs bonding using at least a part of a plating material and/or performs bonding using a metal portion in a state in which at least a part of the plating material is removed.
Dependencies are inferred from the claim text.