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US 2021/0229135 A1Published application
Substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsTadashi Iino, Yoshiteru Fukuda
Life of this patent
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Abstract
A substrate processing apparatus includes an air supply configured to supply air into a place where a substrate is located; and a rectifying member, having multiple through holes, configured to rectify the air supplied from the air supply. The rectifying member includes a base; and a charge diffusion layer formed on a surface of the base. Electric charges attached to a surface of the rectifying member are diffused along the charge diffusion layer.
Claims16
A substrate processing apparatus, comprising:
- an air supply configured to supply air into a place where a substrate is located;
- and
- a rectifying member, having multiple through holes, configured to rectify the air supplied from the air supply,
- wherein the rectifying member comprises:
- a base;
- and
- a charge diffusion layer formed on a surface of the base, and
- wherein electric charges attached to a surface of the rectifying member are diffused along the charge diffusion layer.
5 more elements
Dependencies are inferred from the claim text.