Medical Sensor and Method

A medical sensor configured for being surface mounted to a printed circuit board of a medical device comprising:

• a substrate configured to flex in a predetermined direction wherein the substrate has a center and a centerline;
• a dielectric layer overlying the substrate;
• a first strain gauge overlying the dielectric layer;
• a second strain gauge overlying the dielectric layer;
• a third strain gauge overlying the dielectric layer wherein the second strain gauge and the third strain gauge are configured to measure strain in the predetermined direction, wherein the second and third strain gauge are placed symmetrical about the center of the substrate, and wherein a center of the second and third strain gauges are placed on the centerline;
• and
• a fourth strain gauge overlying the dielectric layer;
• interconnect formed overlying the dielectric layer;
• and
• a plurality of pads formed overlying the dielectric layer wherein the interconnect is configured to couple the first, second, third, and fourth strain gauges into a full bridge Poisson gauge, wherein the interconnect is configured to couple the full bridge Poisson gauge to the plurality of pads, and wherein the medical sensor is configured as a surface mount device (SMD) configured to be picked, placed, and coupled to a printed circuit board of a medical device by an automated process.

A medical sensor configured for being surface mounted to a printed circuit board of a medical device comprising:

• a substrate configured to flex in a predetermined direction wherein the substrate has a center and a centerline;
• a dielectric layer formed overlying the substrate;
• a full bridge Poisson gauge wherein a first metal is configured to be sputtered overlying the dielectric layer, wherein the first metal is configured to be patterned for etching, and wherein the first metal is configured to be etched to form the full bridge Poisson gauge;
• a plurality of surface mount technology (SMT) pads;
• and
• interconnect coupling the plurality of SMT pads to the full bridge Poisson gauge wherein the medical sensor is configured to be picked, placed, and soldered to a printed circuit board and wherein the medical sensor is configured to couple to a medical device such that a first end of the substrate couples to a first support of the medical device and a second end of the substrate couples to a second support of the medical device, wherein the medical device is configured to apply a force, pressure, or load to at least the center of the substrate, and wherein the first support and the second support are configured to have maximum strain in proximity to the centerline of the substrate under load.