Articles having retained strength

An article, comprising:

• a substrate having a thickness and opposing major surfaces including a first major surface and a second major surface;
• a crack mitigating layer disposed on and directly in contact with the first major surface of the substrate, wherein the crack mitigating layer comprises a porous or non-porous polymeric or hybrid organic-inorganic material;
• a first film disposed on the crack mitigating layer having a thickness from about 0.01 μm to about 20 μm;
• and
• a further film disposed on the second major surface of the substrate having a thickness from about 0.01 μm to about 20 μm,
• wherein an average strain-to-failure of the substrate is 0.5% or greater, as measured with the crack mitigating layer disposed on and directly in contact with the first major surface of the substrate and the first film disposed on the crack mitigating layer.

An article, comprising:

• a glass substrate having a thickness and opposing major surfaces including a first major surface and a second major surface;
• a crack mitigating layer disposed on and directly in contact with the first major surface of the glass substrate, wherein the crack mitigating layer comprises a polymeric material and has a thickness from about 0.01 μm to about 0.25 μm;
• a first film disposed on the crack mitigating layer having a thickness from about 0.01 μm to about 20 μm;
• and
• a further film disposed on the second major surface of the substrate having a thickness from about 0.01 μm to about 20 μm,
• wherein an average strain-to-failure of the glass substrate is 0.5% or greater, as measured with the crack mitigating layer disposed on and directly in contact with the first major surface of the substrate and the first film disposed on the crack mitigating layer,
• wherein the first film comprises one or more of SiO2, Al2O3, Nb2O5, Ta2O5, TiO2, and combinations thereof,
• wherein the further film is a layered structure that comprises a scratch-resistant layer and one or more of SiO2, SiOx, SiNy, Si3N4, SiOxNy, and combinations thereof, and
• further wherein the substrate is chemically strengthened and has a surface compressive stress of at least 500 MPa and a compressive depth of layer of at least 15 μm.