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US 2021/0208632 A1Published application
Semiconductor package
AssigneePowerchip Semiconductor Manufacturing Corporation
InventorsChun-Liang Chen, Hann-Jye Hsu
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Abstract
The present disclosure provides a semiconductor package including a substrate, a display unit, a driving circuit, and at least one of memory. The substrate has a display region and a peripheral region. The display unit is disposed in the display region and electrically connects with the display unit. The memory is disposed in the peripheral region and electrically connected with the driving circuit. The driving circuit and the memory are spaced apart from each other.
Claims15
A semiconductor package, comprising:
- a substrate having a display region and a peripheral region;
- a display unit directly disposed on the display region of the substrate;
- a source driving circuit disposed in the peripheral region and electrically connected with the display unit;
- and
- at least one frame buffer memory disposed in the peripheral region and directly and electrically connected with the source driving circuit,
- wherein the source driving circuit and the at least one frame buffer memory are spaced apart from each other in a direction parallel to the substrate,
- wherein the display region and the peripheral region are configured at the different level.
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Dependencies are inferred from the claim text.