Back to results
US 2021/0202897 A1Published application
Inorganic package film, manufacturing method thereof, manufacturing method of oled package film, display panel, and display device
AssigneesBoe Technology Group Co., Ltd., Ordos Yuansheng Optoelectronics Co., Ltd.
InventorsFuyi CUI, Quanqin SUN, Xu CHEN, Ang XIAO
Life of this patent
Estimating the term…
Abstract
An inorganic package film, a manufacturing method thereof, a manufacturing method of an OLED package film, a display panel, and a display device. The manufacturing method includes forming a first inorganic package film on a device to be packaged by a chemical vapor deposition process; and forming a second inorganic package film on the first inorganic package film by an atomic layer deposition process.
Claims20
A method for manufacturing an inorganic package film, comprising:
- forming a first inorganic package film on a device to be packaged by a chemical vapor deposition process;
- forming a second inorganic package film on the first inorganic package film by an atomic layer deposition process.
An inorganic package film comprising:
- a first inorganic package film formed by a chemical vapor deposition process;
- and
- a second inorganic package film located on the first inorganic package film and formed by an atomic layer deposition process.
Dependencies are inferred from the claim text.