Compliant and electro-migration resistant interconnects for CSP
OwnerScott Moore Zimmermaninventor
Life of this patent
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Abstract
Compliant interconnect based on deformable wires compressed against contacts on chip scale packages (CSP). Including deformable rubbery overcoat on at least one of the CSP. The use of substantially optically transmitting overcoat means to secure the assembly is also disclosed. The use of various wires including but not limited to gold, silver, aluminum, carbon nanotube yarns, and composite wires also disclosed.
Claims8
A compliant interconnect comprising at least one semiconductor chip with a deformable overcoat containing at least two contacts, at least one thermally conductive optically transmitting substrate containing one or more pockets, a restraining means, and at least two deformable wires wherein said at least two deformable wires are deformed and form electrical and mechanical contact with said at least two contacts by said at least one thermally conductive optically transmitting substrate and said restraining means
A compliant interconnect comprising;
- at least one semiconductor chip with one or more contacts, at least one carbon nanotube yarn wire, and at least one overcoat wherein said overcoat mechanically and electrically maintains contact between said one or more contacts and said at least one carbon nanotube yarn wire.
Dependencies are inferred from the claim text.