Method of manufacturing light emitting device
AssigneeNichia Corporation
InventorTadao HAYASHI
Life of this patent
Estimating the term…
Loading patent…
AssigneeNichia Corporation
InventorTadao HAYASHI
Estimating the term…
A method of manufacturing a light emitting device includes: providing two light emitting elements disposed on a first surface of a light transmissive member; disposing a light guide member covering a part of the first surface of the light transmissive member, and lateral surfaces of the two light emitting elements; disposing a light reflective member covering the two light emitting elements, a second surface of the light transmissive member, and the light guide member, the second surface of the light transmissive member being opposite to the first surface; and cutting the light reflective member and/or the light transmissive member between the two light emitting elements.
A method of manufacturing a light emitting device, comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Backward citations are indexed for grants only.
Packages: optical field-shaping means, e.g. lenses
Encapsulations: characterised by their shape
Optical field-shaping means, e.g. lenses: reflecting means
Packages: interconnections, e.g. lead-frames, bond wires or solder balls
Term end not estimated
The present disclosure relates to a light emitting device and method of manufacturing the same.
Japanese Unexamined Patent Application Publication No. 2016-48718 discloses a light emitting device as a side-emission type light emitting device including: a flip-chip type light emitting element in which an element substrate, a crystal layer on the element substrate, outer electrodes electrically connected to the crystal layer are included; an optical member having a surface inclined to the outer electrodes, the optical member formed on the element substrate side of the light emitting element; a reflective layer formed on the inclined surface of the optical member. In such light emitting device, light emitted from the light emitting element and entering the optical member is reflected by the reflective member, and extracted from the light extraction surface of the optical member.
The light emitting device disclosed in the above mentioned publication has a poor light emission efficiency due to a poor efficiency of light incident from the light emitting element to the optical member. In order to increase the light output, the light emitting element is needed to be larger, resulting in increase of the size of the light emitting device.
FIG. 1 is a schematic front view of a light emitting device of Embodiment 1.
FIG. 2 is a schematic sectional view of the light emitting device taken along a line II-II in FIG. 1.
FIG. 3 is a schematic sectional view of a light emitting device of another embodiment.
Hereinafter, an embodiment will be appropriately described referring to drawings. However, a light-emitting device described below is provided for the purpose of embodying the technical concept described in the present disclosure, and unless specifically stated otherwise, the present disclosure is not limited to descriptions below. Also, the content of one embodiment and example can be applied to other embodiments and examples. There is a case where a magnitude, aspect ratio or positional relation of members illustrated in each drawing is exaggerated so as to clarify the description.
In FIGS. 1 to 3, an X direction, a Y direction and a Z direction perpendicular to one another are illustrated with allows. The present disclosure may refer to the X direction as a longitudinal direction, the Y direction as a thickness direction, the Z direction as a width direction.
The light emitting device has a rectangular-cuboid outer shape and has six outer surfaces including an upper surface, a lower surface which is opposite to the upper surface and serves as a mounting surface, four lateral surfaces between the upper surface and the lower surface. One of the lateral surfaces is configured with one surface of the light transmissive member exposed from the light emitting device. The surface of the light transmissive member exposed from the light emitting device serves as a light extraction surface, and referred to as a front surface in which the surface of the light transmissive member is included. A surface opposite to the front surface is also referred to as a back surface.