Laser reflow apparatus and laser reflow method

A laser reflow method using a laser reflow apparatus for reflowing solder bumps disposed on a side of a semiconductor chip in a workpiece and included in an irradiation range on the workpiece by applying a laser beam to an opposite side of the semiconductor chip, the laser reflow apparatus including

• a spatial beam modulation unit including a laser power density setting function to locally set the laser power density in the irradiation range of a laser beam emitted from a laser beam source, and an image focusing unit including an image focusing function to focus the laser beam emitted from the laser beam source and apply the focused laser beam to the irradiation range on the workpiece, or
• a spatial beam modulation unit including a laser power density setting function to locally set the laser power density in the irradiation range of the laser beam emitted from the laser beam source and an image focusing function to focus the laser beam emitted from the laser beam source and apply the focused laser beam to the irradiation range on the workpiece, the laser reflow method comprising:
• individually setting the laser power densities of the laser beams to be applied respectively to particular areas in the irradiation range.