Semiconductor packages and methods of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsCheng-Yen Hsieh, Chun-Hui Yu, Ping-Kang Huang, Sao-Ling Chiu, Yi-Jhang Wang
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Abstract
A semiconductor package includes a first interposer, a second interposer, a first die, a second die and at least one bridge structure. The first interposer and the second interposer are embedded by a first dielectric encapsulation. The first die is disposed over and electrically connected to the first interposer. The second die is disposed over and electrically connected to the second interposer. The at least one bridge structure is disposed between the first die and the second die.
Claims20
A semiconductor package, comprising:
- a first interposer and a second interposer embedded by a first dielectric encapsulation;
- a first die disposed over and electrically connected to the first interposer;
- a second die disposed over and electrically connected to the second interposer;
- and
- at least one bridge structure disposed between the first die and the second die.
A method of forming a semiconductor package, comprising:
- providing a first interposer and a second interposer;
- forming a first redistribution layer structure over the first interposer and the second interposer at first sides of the first interposer and the second interposer, wherein the first redistribution layer structure is electrically connected to the first interposer and the second interposer;
- and
- placing a first die, a second die and at least one bridge structure over the first redistribution layer structure, wherein the first interposer is electrically connected to the second interposer through the at least one bridge structure between the first die and the second die.
A semiconductor package, comprising:
- a board substrate;
- a first interposer and a second interposer disposed over the board substrate;
- a first die disposed over the first interposer;
- and
- a second die disposed over the second interposer and extending onto the first interposer.
Dependencies are inferred from the claim text.