Substrate transfer apparatus and substrate transfer system using the same

A substrate transfer system, comprising:

• a chuck table for performing a grinding process on a semiconductor substrate seated on an upper surface of the chuck table;
• and
• a substrate transfer apparatus disposed on an upper portion of the semiconductor substrate and configured to adhere to the semiconductor substrate on which the grinding process has been performed,
• wherein the substrate transfer apparatus comprises:
• a body comprising a first surface to which a semiconductor substrate is configured to be adhered and a second surface opposing the first surface, the first surface having a cavity disposed in a center region of the body and an attaching unit disposed on an edge of the body so as to surround the cavity and form negative pressure to adhere to the semiconductor substrate;
• and
• a connector configured to connect to the second surface of the body and to support the body,
• wherein the cavity comprises a lower surface with at least one through hole penetrating the first and second surfaces and connecting the cavity to an external space, and the cavity comprises a side surface inclined at an angle of 2.9° to 5° with respect to the first surface at the edge of the body.