Processing apparatus for electronic component

A processing apparatus for an electronic component, the processing apparatus comprising:

• a first illumination portion configured to irradiate a second inner surface and a third inner surface of the electronic component with a first irradiation light via a first outer surface of the electronic component in a state where the electronic component is disposed on a first inspection position, the first irradiation light being capable of passing through at least a part of the electronic component, and the electric component including the first outer surface, a second outer surface on an reverse side of the first outer surface, a third outer surface connected to the first outer surface and the second outer surface, the second inner surface on an opposite side of the second outer surface, the third inner surface on an opposite side of the third outer surface, and a first internal corner portion formed by the second inner surface and the third inner surface;
• and
• a first imaging portion configured to capture an image of the first internal corner portion based on the first irradiation light emitted from the first outer surface after being specularly reflected on the second inner surface and the third inner surface.