Method and apparatus for treating a substrate
OwnerJohannes Weichart, Jurgen Weichartinventors
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Abstract
A method of treating a substrate or of manufacturing a treated substrate includes the following steps: a) first treating a substrate in a first atmosphere of a first pressure, b) subsequently, second treating the first treated substrate in a second atmosphere of a second pressure, wherein the second temperature of the substrate is different from the first temperature and the second pressure is lower than the first pressure, c) between steps a) and b) locking in the first treated substrate from the first atmosphere into the second atmosphere, d) during locking in, heating or cooling the first treated substrate from the first temperature towards the second temperature.
Claims42
A method of treating a substrate or of manufacturing a treated substrate, comprising following steps:
- a) first treating a substrate in a first atmosphere of a first pressure, resulting in a first treated substrate having a first temperature;
- b) subsequently, second treating said first treated substrate in a second atmosphere of a second pressure, starting said second treating at a second temperature of said first treated substrate and resulting in said treated substrate, wherein said second temperature is different from said first temperature and said second pressure is lower than said first pressure;
- c) between steps a) and b) locking in said first treated substrate from said first atmosphere into said second atmosphere;
- d) during said locking in, heating or cooling said first treated substrate from said first temperature towards said second temperature.
A method of heating or cooling a floppy substrate in vacuum comprising pressing said substrate onto a heating or cooling surface by generating a drop of pressure across said substrate directed towards said heating or cooling surface.
A substrate treatment apparatus, comprising:
- a) a first treatment station for at least one substrate and constructed to treat said at least one substrate in a first atmosphere at a first pressure and comprising a first station output for a first treated substrate;
- b) a second treatment station for at least one substrate and constructed to treat said at least one first treated substrate in a second atmosphere at a second pressure which is lower than said first pressure and comprising a second station input for a first treated substrate;
- c) a load lock chamber interconnected between said first station output and said second station input;
- d) a controlled heat exchange device in said load lock chamber adapted to exchange heat with a first treated substrate in said load lock chamber, controlled to be enabled as said first treated substrate is load-locked through said load lock chamber from said first treatment station to said second treatment station.
Dependencies are inferred from the claim text.