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US 2021/0202280 A1Published application
Substrate heating unit, substrate processing apparatus, and substrate processing method
AssigneeSemes Co., Ltd.
InventorsTae Shin KIM, Young Dae CHUNG, Ji Hoon JEONG, Jee Young LEE, Won Geun KIM
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Abstract
Proposed is a substrate heating unit including: a laser generator providing a laser beam for heating a substrate; and a beam shaper processing the laser beam from the laser generator and selectively providing one of a first beam having a uniform energy distribution and a second beam having an edge-enhanced energy distribution to the substrate.
Claims20
A substrate heating unit comprising:
- a laser generator configured to generate a first laser beam which is directed toward a substrate;
- and
- a beam shaper configured to shape an energy distribution of the first laser beam received from the laser generator to selectively provide the substrate with a second laser beam having one of a uniform energy distribution over the substrate and an edge-enhanced energy distribution in which a first portion of the second laser beam is directed toward an edge portion of the substrate, and a second portion of the second laser beam is directed toward a central portion of the substrate, wherein the first portion of the second laser beam has an energy intensity higher than an energy intensity of the second portion of the second laser beam.
A substrate processing apparatus comprising:
- a substrate support unit configured to support a substrate and provided with an exposure opening through which a lower surface of the supported substrate is exposed;
- and
- a substrate heating unit configured to heat the substrate supported by the substrate support unit,
- wherein the substrate heating unit comprises:
- a laser generator configured to generate a first laser beam which is directed toward a substrate;
- and
- a beam shaper configured to shape an energy distribution of the first laser beam received from the laser generator to selectively provide the substrate with a second laser beam having one of a uniform energy distribution over the substrate and an edge-enhanced energy distribution in which a first portion of the second laser beam is directed toward an edge portion of the substrate, and a second portion of the second laser beam is directed toward a central portion of the substrate,
- wherein the first portion of the second laser beam has an energy intensity higher than an energy intensity of the second portion of the second laser beam, and
- wherein the second laser beam irradiates on the lower surface of the substrate through the exposure opening of the substrate support unit.
6 more elements
A substrate processing method comprising:
- supplying a processing liquid to an upper surface of a substrate;
- processing the substrate with the processing liquid;
- and
- irradiating a laser beam on the substrate, thereby heating the substrate during a time when the substrate is being processed with the processing liquid,
- wherein the irradiating of the laser beam on the substrate includes shaping an energy distribution of the laser beam to have one of a uniform energy distribution over the substrate and an edge-enhanced energy distribution in which a first portion of the laser beam is directed toward an edge portion of the substrate, and a second portion of the laser beam is directed toward a central portion of the substrate, and
- wherein the first portion of the first laser beam has an energy intensity higher than an energy intensity of the second portion of the laser beam.
3 more elements
Dependencies are inferred from the claim text.