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US 2021/0202275 A1Published application
Tools and methods for subtractive metal patterning
AssigneeIntel Corporation
InventorChristopher J. Jezewski
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Abstract
Disclosed herein are tools and methods for subtractively patterning metals. These tools and methods may permit the subtractive patterning of metal (e.g., copper, platinum, etc.) at pitches lower than those achievable by conventional etch tools and/or with aspect ratios greater than those achievable by conventional etch tools. The tools and methods disclosed herein may be cost-effective and appropriate for high-volume manufacturing, in contrast to conventional etch tools.
Claims20
A metal etch tool, comprising:
- a chamber;
- an electrode inside the chamber;
- and
- a target material inside the chamber, wherein the electrode and the target material have a same material composition.
1 more element
An integrated circuit (IC) component, comprising:
- a metallization layer, including:
- a first metal feature,
- a first trench,
- a second metal feature, wherein the first trench is between the first metal feature and the second metal feature,
- a second trench, and
- a third metal feature, wherein the second trench is between the second metal feature and the third metal feature;
- wherein:
- the first trench has an aspect ratio between 2:1 and 5:1,
- the second trench has an aspect ratio between 2:1 and 5:1, and
- a pitch of the first trench and the second trench is less than 40 nanometers.
7 more elements
A method of operating a metal etch tool, comprising:
- placing a sample in a chamber of the metal etch tool, wherein the sample includes a metal to be etched, the metal etch tool includes an electrode in the chamber, and the electrode includes the metal;
- and
- controlling the metal etch tool to etch the metal of the sample;
- and
- removing the etched sample from the chamber.
2 more elements
Dependencies are inferred from the claim text.