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US 2021/0202272 A1Published application
Apparatus and method for die stack flux removal
AssigneeVeeco Instruments Inc.
InventorsJohn Taddei, Kenji Nulman, Jonathan Fijal, Phillip Tyler, Ian Rafter
Life of this patent
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Abstract
A system for removing flux from openings formed in a substrate that has openings (e.g., sized 20 microns or less) formed therein includes a spay nozzle device that has a spray nozzle arm that is formed at an angle of about 45 degrees or less for discharging fluid towards the openings in the substrate for flux removal. The angle is between about 30 degrees and 45 degrees.
Claims20
A method for treating a substrate that has openings formed therein, comprising the steps of:
- wetting the substrate with a first fluid by positioning the substrate within a first immersion bath for filling the openings in the substrate with the first fluid;
- and
- spraying the wetted substrate with a spay nozzle device that discharges a second fluid, wherein the spray nozzle device is configured such that a spray nozzle arm thereof is formed at an angle between 30 degrees and 45 degrees relative to a horizontal reference plane for discharging the second fluid towards the openings in the wetted substrate.
A system for removing flux from openings formed in a substrate that has openings formed therein comprising:
- a spay nozzle device that has a spray nozzle arm that is formed at an angle of between 30 degrees and 45 degrees relative to a horizontal reference plane for discharging fluid towards the openings in the substrate for flux removal.
Dependencies are inferred from the claim text.