Package device and manufacturing method thereof
AssigneePowertech Technology Inc.
InventorsNan-Chun Lin, Hung-Hsin Hsu, Shang-Yu Chang Chien
Life of this patent
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Abstract
A package device and a manufacturing method thereof are provided. The manufacturing method of the package device includes providing a substrate and forming a redistribution layer on the substrate. The substrate has at least one device region and a non-device region. The redistribution layer includes at least one inspection structure and at least one wire structure. The wire structure is disposed in the device region, a part of the inspection structure and a part of the wire structure are formed of a same layer, and the inspection structure has a trench exposing the part of the inspection structure.
Claims18
A manufacturing method of a package device, comprising:
- providing a substrate, wherein the substrate has at least one device region and a non-device region;
- and
- forming a redistribution layer on the substrate, wherein the redistribution layer comprises at least one inspection structure and at least one wire structure, the at least one wire structure is disposed in the at least one device region, a part of the at least one inspection structure and a part of the at least one wire structure are formed of a same layer, and the at least one inspection structure has a trench exposing the part of the at least one inspection structure,
- wherein the redistribution layer comprises a first conductive layer and an insulating layer, the first conductive layer is disposed between the substrate and the insulating layer, the part of the at least one inspection structure comprises at least one first inspection block, and the insulating layer partially overlap the at least one first inspection block in a top-view direction of the substrate.
A package device, comprising:
- a substrate;
- and
- a redistribution layer disposed on the substrate, wherein the redistribution layer comprises at least one inspection structure and at least one wire structure, a part of the at least one inspection structure and a part of the at least one wire structure are formed of a same layer, and the at least one inspection structure has a trench exposing the part of the at least one inspection structure,
- wherein the redistribution layer comprises a first conductive layer and an insulating layer, the first conductive layer is disposed between the substrate and the insulating layer, the part of the at least one inspection structure comprises at least one first inspection block, and the insulating layer partially overlap the at least one first inspection block in a top-view direction of the substrate.
Dependencies are inferred from the claim text.