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US 2021/0202248 A1Published application
Film forming method and film forming apparatus
AssigneeTokyo Electron Limited
InventorsYoshihiro TAKEZAWA, Daisuke SUZUKI, Hiroyuki HAYASHI, Yutaka MOTOYAMA
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Abstract
A film forming method includes: forming a laminated film, in which an interface layer, a bulk layer, and a surface layer are laminated in this order, on a base; and crystallizing the laminated film, wherein the bulk layer is formed of a film that is easier to crystallize than the interface layer in crystallizing the laminated film, and wherein the surface layer is formed of a film that is easier to crystallize than the bulk layer in crystallizing the laminated film.
Claims13
A film forming method comprising:
- forming a laminated film, in which an interface layer, a bulk layer, and a surface layer are laminated in this order, on a base;
- and
- crystallizing the laminated film,
- wherein the bulk layer is formed of a film that is easier to crystallized than the interface layer in crystallizing the laminated film, and
- wherein the surface layer is formed of a film that is easier to crystallize than the bulk layer in crystallizing the laminated film.
2 more elements
A film forming apparatus comprising:
- a processing part;
- and
- a controller,
- wherein the controller is configured to control the processing part to execute:
- forming a laminated film, in which an interface layer, a bulk layer, and a surface layer are laminated in this order, on a base;
- and
- crystallizing the laminated film,
- wherein the bulk layer is formed of a film that is easier to crystallize than the interface layer in crystallizing the laminated film, and
- wherein the surface layer is formed of a film that is easier to crystallize than the bulk layer in crystallizing the laminated film.
6 more elements
Dependencies are inferred from the claim text.