Multilayer electronic component and board having the same mounted thereon

A board having a multilayer electronic component mounted thereon, the board comprising:

• a substrate having first and second electrode pads on one surface;
• and
• a multilayer electronic component including:
• a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the capacitor body having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces and opposing each other, one ends of the plurality of first and second internal electrodes being exposed to the third and fourth surfaces, respectively;
• first and second external electrodes including first and second connecting portions disposed on the third and fourth surfaces of the capacitor body, respectively, and first and second band portions extending from the first and second connecting portions to portions of the first surface of the capacitor body, respectively;
• first and second connection terminals connected to the first band portion, on a first surface side of the capacitor body, and spaced apart from each other;
• and third and fourth connection terminals connected to the second band portion, on the first surface side of the capacitor body, and spaced apart from each other, wherein each of the first and second connection terminals includes a first connection surface facing the first band portion, a second connection surface opposing the first connection surface, and a first circumferential surface connecting the first and second connection surfaces, a cross section of the first circumferential surface being circular, and each of the third and fourth connection terminals includes a third connection surface facing the second band portion, a fourth connection surface opposing the third connection surface, and a second circumferential surface connecting the third and fourth connection surfaces, a cross section of the second circumferential surface being circular,
• wherein the first and second connection terminals are disposed on the first electrode pad to be connected thereto, and the third and fourth connection terminals are disposed on the second electrode pad to be connected thereto.

A multilayer electronic component comprising:

• a capacitor body including dielectric layers and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the capacitor body including first and second surfaces opposing each other;
• first and second external electrodes respectively connected to the first internal electrodes and the second internal electrodes, and each including a portion disposed on the first surface of the capacitor body;
• a first connection terminal disposed on the portion of the first external electrode;
• and
• a second connection terminal disposed on the portion of the second external electrode,
• wherein each of the first and second connection terminals has a recess extending from a lower surface thereof toward an upper surface thereof in a direction from the first surface to the second surface.