Ptc device including polyswitch

A positive temperature coefficient (PTC) device, comprising:

• a PTC protection component;
• a first electrode layer extending along a first main side of the PTC protection component, the first electrode layer including a first section separated from a second section by a first gap;
• a second electrode layer extending along a second main side of the PTC protection component, the second electrode layer including a third section separated from a fourth section by a second gap, wherein the first gap is aligned with the second gap;
• a first insulation layer disposed over the first electrode layer, and a second insulation layer disposed over the second electrode layer, wherein the first insulation layer is formed within the first gap, and wherein the second insulation layer is formed within the second gap;
• and
• a solder pad extending around an end of the PTC protection component, the solder pad further extending over the first insulation layer and the second insulation layer.

A method of forming a positive temperature coefficient (PTC) device, the method comprising:

• providing a PTC protection component;
• providing a first electrode layer along a first main side of the PTC protection component, the first electrode layer including a first section separated from a second section by a first gap;
• providing a second electrode layer along a second main side of the PTC protection component, the second electrode layer including a third section separated from a fourth section by a second gap, wherein the first gap is aligned with the second gap;
• providing a first insulation layer over the first electrode layer, and providing a second insulation layer over the second electrode layer;
• and
• provide a solder pad around an end of the PTC protection component, the solder pad further extending over the first insulation layer and the second insulation layer.