Optoelectronic computing systems

An optoelectronic computing system comprising:

• a first semiconductor die comprising a photonic integrated circuit (PIC), the photonic integrated circuit comprising:
• a plurality of optical waveguides configured to carry optical signals, wherein a set of multiple input values are encoded on respective optical signals carried by the optical waveguides,
• an optical network comprising a plurality of optical splitters or directional couplers, and
• an array of optoelectronic circuitry sections, in which each optoelectronic circuitry section is configured to receive an optical wave from one of the output ports of the optical network, and each optoelectronic circuitry section includes:
• at least one photodetector configured to detect at least one optical wave from an operation;
• and
• at least one conductive line integrated in the photonic integrated circuit electrically coupled to the photodetector and electrically coupled to an electrical output port;
• and
• a second semiconductor die comprising an electronic integrated circuit (EIC), the electronic integrated circuit comprising:
• a plurality of electrical input ports receiving respective electrical values;
• wherein the first semiconductor die and the second semiconductor die are electrically coupled in a controlled collapse chip connection, with the electrical output port of the photonic integrated circuit connected to one of the electrical input ports of the electronic integrated circuit.

An optoelectronic computing system comprising:

• a first semiconductor die comprising a photonic integrated circuit (PIC), the photonic integrated circuit comprising:
• a plurality of optical waveguides configured to carry optical signals, wherein a set of multiple input values are encoded on respective optical signals carried by the optical waveguides,
• an optical copying distribution network comprising a plurality of optical splitters, in which each optical splitter is configured to send a portion of the power of an input optical wave at an input port to each of two output ports of the optical splitter, and output ports of the optical copying distribution network each provide a portion of the input optical wave carrying an optical signal that encodes one of the input values scaled by the same fraction, and
• an array of optoelectronic circuitry sections, in which each optoelectronic circuitry section is configured to receive an optical wave from one of the output ports of the optical copying distribution network, and each optoelectronic circuitry section includes:
• at least one photodetector configured to detect at least one optical wave from an optoelectronic operation;
• and
• at least one conductive path integrated in the photonic integrated circuit electrically coupled to the photodetector and electrically coupled to an electrical output port;
• and
• a second semiconductor die comprising an electronic integrated circuit (EIC), the electronic integrated circuit comprising:
• a plurality of electrical input ports receiving respective electrical values;
• wherein the first semiconductor die and the second semiconductor die are electrically coupled in a controlled collapse chip connection, with the electrical output port of the photonic integrated circuit connected to one of the electrical input ports of the electronic integrated circuit.

A method comprising:

• encoding a set of multiple input values on respective optical signals using a first set of optical amplitude modulators;
• at a first semiconductor die comprising a photonic integrated circuit (PIC), for each of at least two subsets of one or more optical signals, splitting the subset of one or more optical signals into two or more copies of the one or more optical signals;
• transmitting the copies of the at least two subsets of one or more optical signals to an array of optoelectronic circuitry sections,
• at each optoelectronic circuitry section of the array of optoelectronic circuitry sections, detecting at least one optical wave from an operation to generate at least one electric signal, and transmitting the at least one electric signal through at least one conductive path integrated in the photonic integrated circuit to a second semiconductor die comprising an electronic integrated circuit (EIC) that is electrically coupled to the first semiconductor die in a controlled collapse chip connection, and
• processing the at least one electric signal using the electronic integrated circuit.

An optoelectronic computing system comprising:

• a photonic integrated circuit (PIC) comprising:
• a first optical waveguide disposed at a first depth in the photonic integrated circuit;
• a second optical waveguide disposed at a second depth in the photonic integrated circuit;
• a first set of coupling structures configured to enable transition of an optical signal from the first waveguide to the second waveguide through the first set of coupling structures, in which the first set of coupling structures are disposed at depths between the first depth and the second depth, different coupling structures are disposed at different depths;
• wherein the first set of coupling structures comprise at least a first coupling structure and a second coupling structure that have dimensions and relative positions configured such that as the optical signal transition from the first waveguide to the second waveguide, at some point in time during the transition, at least 10% of power of the optical signal is transmitted in each of the first and second coupling structures concurrently.