Fingerprint identification module, manufacturing method thereof and electronic device

Abstract

A fingerprint identification module, a manufacturing method thereof and an electronic device are disclosed. The fingerprint identification module includes a substrate, a piezoelectric material layer, an auxiliary structure and a plurality of first driving electrodes; the piezoelectric material layer is on the substrate, the auxiliary structure is at least partially located on the substrate, and the plurality of first driving electrodes are on a side, away from the substrate, of the piezoelectric material and the auxiliary structure; each first driving electrode extends along a first direction and exceeds a first edge of the piezoelectric material layer in the first direction; the plurality of first driving electrodes are arranged at intervals along a second direction; the auxiliary structure is at least in contact with the first edge; the auxiliary structure includes a slope portion; and a thickness of the slope portion in a direction perpendicular to the functional substrate gradually decreases in a direction from the first edge to a position away from a center of the piezoelectric material layer. The fingerprint identification module can avoid the problems of wire disconnection and conductive material residue in the process of forming the plurality of first driving electrodes on the piezoelectric material layer, thereby improving the yield of products.

Dependencies are inferred from the claim text.