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AssigneeAnsys, Inc.
InventorsAkhilesh Kumar, Norman Chang, Hsiming Pan, Jimin Wen, Deqi Zhu, Wenbo Xia, Wen-Tze Chuang, En-Cih Yang, Karthik Srinivasan, Ying-Shiun Li
Estimating the term…
Machine assisted systems and methods for enhancing the resolution of an IC thermal profile from a system analysis are described. The methods can include generating a representation of two or more templates identifying different portions of an integrated circuit (IC); performing a thermal simulation for each respective template of the IC based on a sequence of power patterns of tiles of the respective template; and training a neural network with a plurality of training data collected via thermal simulations performed for the templates of the IC. These systems and methods can use a machine learning predictor, that has been trained to determine a transient temperature rise across an entire IC, and then append the determined transient temperature rise to a system level thermal profile of the IC.
A non-transitory machine readable medium storing executable program instructions which when executed by a data processing system cause the data processing system to perform a method, the method comprising:
A non-transitory machine readable medium storing executable program instructions which when executed by a data processing system cause the data processing system to perform a method, the method comprising:
Dependencies are inferred from the claim text.