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US 2021/0200464 A1Published application
Memory device interface and method
AssigneeMicron Technology, Inc.
InventorBrent Keeth
Life of this patent
Estimating the term…
Abstract
Apparatus and methods are disclosed, including memory devices and systems. In an example, a memory module can include a first stack of at least eight memory die including four pairs of memory die, each pair of the four pairs of memory die associated with an individual memory rank of four memory ranks of the memory module, a memory controller configured to receive memory access commands and to access memory locations of the first stack, and a substrate configured to route connections between external terminations of the memory module and the memory controller.
Claims26
A memory module comprising:
- a first stack of at least eight memory die including four pairs of memory die, each pair of the four pairs of memory die associated with an individual memory rank of four memory ranks of the memory module;
- a memory controller configured to receive memory access commands and to access memory locations of the first stack;
- and
- a substrate configured to route connections between external terminations of the memory module and the memory controller.
1 more element
A method comprising:
- storing information at memory cells of a stack of at least eight memory devices;
- and
- organizing the information across four ranks of memory cells, wherein each rank of the four ranks is assigned to at least two of the at least eight memory devices.
Dependencies are inferred from the claim text.