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US 2021/0200187 A1Published application
Thermal behavior prediction from a contone map
AssigneeHewlett-Packard Development Company, L.P.
InventorsJun Zeng, He Luan
Life of this patent
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Abstract
Examples of a thermal behavior prediction method are described herein. In some examples of the thermal behavior prediction method, a predicted heat map of a layer corresponding to a three-dimensional (3D) model is computed using at least one neural network. The predicted heat map is computed based on a contone map corresponding to the 3D model.
Claims15
A method for thermal behavior prediction by an electronic device, comprising:
- computing, using at least one neural network, a predicted heat map of a layer corresponding to a three-dimensional (3D) model, wherein said computing is based on a contone map corresponding to the 3D model.
A three-dimensional (3D) printing system, comprising:
- a build area;
- a print head configured to print a fusing agent based on a fusing contone map and to print a detailing agent based on a detailing contone map;
- a thermal projector;
- and
- a controller, wherein the controller is configured to:
- use at least one neural network to predict thermal behavior of a layer based on the fusing contone map and the detailing contone map.
3 more elements
A non-transitory tangible computer-readable medium storing executable code, comprising:
- code for causing a processor to predict, using at least one neural network, thermal behavior of a layer corresponding to a 3D model based on voxel-level machine instructions.
Dependencies are inferred from the claim text.