Pattern forming method and resist laminate for organic solvent development

A pattern forming method, comprising:

• preparing a laminate having a substrate, an inorganic base layer on the substrate, and a resist layer provided on the inorganic base layer in such a manner that the resist layer contacts the inorganic base layer;
• exposing the resist layer;
• and
• developing the laminate using a developer comprising an organic solvent to form a negative tone pattern,
• wherein a surface energy γA of the resist layer after irradiation of the laminate with ultraviolet rays having a wavelength of 13.5 nm from the resist layer side with an integrated light quantity of 40 mJ/cm2, followed by heating of the laminate at 110° C. for 60 seconds is 60 mJ/m2 or more,
• wherein a surface energy γB of the inorganic base layer after irradiation of the laminate with ultraviolet rays having a wavelength of 13.5 nm from the resist layer side with an integrated light quantity of 40 mJ/cm2, followed by heating of the laminate at 110° C. for 60 seconds is 55 mJ/m2 or more, and
• wherein a difference γAB in surface energies that is defined by Formula (A) is 5.0 mJ/m2 or less:
• γAB=γA−γB Formula (A).