Dispensing Nozzle Design and Dispensing Method Thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei Chang Cheng, Chi-Hung Liao
Life of this patent
Estimating the term…
Abstract
A method of dispensing a fluid in a semiconductor manufacturing process includes providing a substrate, positioning a nozzle above the substrate, and determining a cross-sectional shape of the nozzle. The method also includes configuring the nozzle to have the determined cross-sectional shape and applying the fluid to the substrate through the nozzle with the determined cross-sectional shape.
Claims20
A method of dispensing a fluid in a semiconductor manufacturing process, comprising:
- providing a substrate;
- positioning a nozzle above the substrate;
- determining a cross-sectional shape of the nozzle;
- configuring the nozzle to have the determined cross-sectional shape;
- and
- applying the fluid to the substrate through the nozzle with the determined cross-sectional shape.
A method of dispensing a fluid in a semiconductor manufacturing process, comprising:
- securing a substrate on a chuck;
- positioning a nozzle above the substrate, the nozzle having an initial cross-sectional shape;
- applying a mechanical force on an outer surface of the nozzle, such that the nozzle having an adjusted cross-sectional shape that is different from the initial cross-sectional shape;
- and
- flowing the fluid through the nozzle towards the substrate.
A method of dispensing a fluid, comprising:
- providing a substrate;
- positioning a nozzle above the substrate;
- positioning a gas sprayer in a proximate region of the nozzle;
- flowing the fluid to the substrate through the nozzle;
- and
- blowing a gas through the gas sprayer towards the nozzle, thereby changing an ambient pressure in the proximate region of the nozzle and consequently changing a cross-sectional profile of a path of the fluid leaving the nozzle.
Dependencies are inferred from the claim text.