Damping adhesive layers for microspeaker diaphragms
Assignee3M Innovative Properties Company
InventorsChao Yang, Christopher B. Walker, JR., Daniel J. O'Neal
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Assignee3M Innovative Properties Company
InventorsChao Yang, Christopher B. Walker, JR., Daniel J. O'Neal
Estimating the term…
Thin films are provided comprising a damping adhesive comprising a polysiloxane or mixture of polysiloxanes and exhibiting a tan delta of at least 0.42 for every temperature between 20° C. and 250° C. and a tan delta at 250° C. that is no more than 0.20 greater than the minimum tan delta measured in the range of 20° C. to 250° C.; in some cases exhibiting a tan delta of at least 0.42 for every temperature between 20° C. and 200° C. and a tan delta at 200° C. that is no more than 0.08 greater than the minimum tan delta measured in the range of 20° C. to 200° C.; in some cases obtained by crosslinking polysiloxane(s) by e-beam or peroxide. Microspeaker diaphragm materials, subassemblies and transfer tapes comprising such films are also provided.
A film having a thickness of at least 4 microns and less than 60 microns comprising a damping adhesive which comprises a polysiloxane or mixture of polysiloxanes, wherein the damping adhesive exhibits a tan delta of at least 0.42 for every temperature between 20° C. and 250° C., and wherein the damping adhesive exhibits a tan delta at 250° C. that is no more than 0.20 greater than the minimum tan delta measured in the range of 20° C. to 250° C.
A film having a thickness of at least 4 microns and less than 60 microns comprising a damping adhesive which comprises a polysiloxane or mixture of polysiloxanes, wherein the damping adhesive exhibits a tan delta of at least 0.42 for every temperature between 20° C. and 200° C., and wherein the damping adhesive exhibits a tan delta at 200° C. that is no more than 0.08 greater than the minimum tan delta measured in the range of 20° C. to 200° C.
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A film having a thickness of at least 4 microns and less than 45 microns comprising a damping adhesive, obtained by crosslinking polysiloxane(s) by exposing the polysiloxane(s) in the form of a polysiloxane film having a thickness of greater than 5 microns and less than 45 microns to e-beam radiation or peroxide, wherein polysiloxane(s) means a polysiloxane or mixture of polysiloxanes, and wherein the polysiloxane(s) include:
Dependencies are inferred from the claim text.