Pressure-sensitive adhesive with filler
Assignee3M Innovative Properties Company
InventorDean M. Moren
Life of this patent
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Abstract
Provided are curable precursor compositions for pressure-sensitive adhesives and related articles, assemblies and methods. The provided compositions contain an alkyl (meth)acrylate, a hollow non-porous particulate filler, and a surface-modifying agent comprising a hydrophobic alkoxy silane or hydrophobic organofunctional polysiloxane. These compositions and methods enable in situ functionalization of the filler particles during or after the time they are combined with the curable resin components, thereby allowing pressure-sensitive adhesive materials to be made faster and more efficiently than when using conventional manufacturing methods.
Claims11
A pressure-sensitive adhesive assembly, comprising:
- a backing layer;
- and
- a first cured pressure-sensitive adhesive composition, comprising:
- an alkyl (meth)acrylate;
- a hollow non-porous particulate filler;
- and
- a surface-modifying agent comprising a hydrophobic alkoxy silane or hydrophobic organofunctional polysiloxane,
- wherein the first pressure-sensitive adhesive layer is disposed on the backing layer, and wherein the first pressure-sensitive adhesive layer is a polymeric foam layer.
Dependencies are inferred from the claim text.