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US 2021/0198526 A1Published application
Sheet for heat bonding and sheet for heat bonding having dicing tape
AssigneeNitto Denko Corporation
InventorsSatoshi Honda, Yuki Sugo, Mayu Shimoda
Life of this patent
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Abstract
A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and a component migration prevention layer.
Claims7
A sheet for heat bonding comprising:
- a pre-sintering layer serving as a sintered layer after being heated;
- and
- a component migration prevention layer.
Dependencies are inferred from the claim text.