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US 2021/0197737 A1Published application
Adhesive resins and films for composites and tapes and methods of using the same
AssigneeZephyros, Inc.
InventorSylvain Gleyal-Martinez
Life of this patent
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Abstract
Reformable epoxy resins are disclosed for use in films, composites, and tapes and more particularly for uses of such materials for reinforcing, surface treating, adhering, laminating and stiffening.
Claims21
1:
- An interior trim for a vehicle interior comprising:
- i. an insert having a first profile shape;
- ii. a reformable epoxy resin adhesive film located in direct planar contact with the insert;
- iii. an optional metallic portion located on or within at least one of the vehicle interior, the insert, or the adhesive film;
- wherein the adhesive film has a glass transition temperature higher than room temperature but lower than 200° C. and upon exposure to temperatures at or above its glass transition temperature, the adhesive film bonds the insert to a vehicle interior and the insert is free of any mechanical fastener for attaching the insert to the vehicle interior.
2 more elements
2-5. (canceled)
6:
- A method for forming the interior trim of claim 1 comprising:
- i. providing the insert of claim 1 having a first profile shape;
- ii. locating a reformable epoxy resin adhesive into direct planar contact with the insert;
- iii. molding the first fibrous layer and adhesive into a second profile shape with the application of heat.
1 more element
7:
- The method of claim 6 wherein the reformable epoxy resin adhesive has a glass transition a glass transition temperature (Tg) as measured by differential scanning calorimetry according to ASTM E1356-08(2014) of from about 60° to about 90° (e.g., about 80° C.).
8:
- The method of claim 6 wherein the reformable epoxy resin adhesive has a glass transition a glass transition temperature (Tg) as measured by differential scanning calorimetry according to ASTM E1356-08(2014) of greater than about 90° C., about 100° C., about 110° C., or about 120° C.
9:
- The method of claim 6 wherein the reformable epoxy resin adhesive is a thermoplastic condensation reaction product of a reaction of a mono-functional or di-functional species with an epoxide-containing moiety reacted under conditions for causing the hydroxyl moieties to react with the epoxy moieties to form a generally linear backbone polymer chain with ether linkages.
10:
- The method of claim 6, wherein the reformable epoxy resin adhesive is activated by any stimulus that raises the temperature of the adhesive at or above its glass transition temperature.
11:
- The method of claim 6, wherein the reformable epoxy resin adhesive is formed as a pellet prior to use.
12:
- The method of claim 6, wherein the reformable epoxy resin adhesive is applied by a robotic arm device.
13:
- The method of claim 6, wherein the reformable epoxy resin adhesive is formed as a pellet prior to use and then heated in a dispensing device.
14:
- The method of claim 6, wherein the reformable epoxy resin adhesive is located onto or impregnated within one or more fibrous layers.
15:
- The interior trim of claim 1, wherein the reformable epoxy resin adhesive has a glass transition a glass transition temperature (Tg) as measured by differential scanning calorimetry according to ASTM E1356-08(2014) of from about 60° to about 90° (e.g., about 80° C.).
16:
- The interior trim of claim 1, wherein the reformable epoxy resin adhesive has a glass transition a glass transition temperature (Tg) as measured by differential scanning calorimetry according to ASTM E1356-08(2014) of greater than about 90° C., about 100° C., about 110° C., or about 120° C.
17:
- The interior trim of claim 1, wherein the reformable epoxy resin adhesive is a thermoplastic condensation reaction product of a reaction of a mono-functional or di-functional species with an epoxide-containing moiety reacted under conditions for causing the hydroxyl moieties to react with the epoxy moieties to form a generally linear backbone polymer chain with ether linkages.
18:
- The interior trim of claim 15, wherein the reformable epoxy resin adhesive is a thermoplastic condensation reaction product of a reaction of a mono-functional or di-functional species with an epoxide-containing moiety reacted under conditions for causing the hydroxyl moieties to react with the epoxy moieties to form a generally linear backbone polymer chain with ether linkages.
19:
- The interior trim of claim 1, wherein the reformable epoxy resin adhesive is formed as a pellet prior to use.
20:
- The interior trim of claim 18, wherein the reformable epoxy resin adhesive is formed as a pellet prior to use.
21:
- The interior trim of claim 1, wherein the reformable epoxy resin adhesive is applied by a robotic arm device.
22:
- The interior trim of claim 20, wherein the reformable epoxy resin adhesive is applied by a robotic arm device.
23:
- The interior trim of claim 1, wherein the reformable epoxy resin adhesive is located onto or impregnated within one or more fibrous layers.
24:
- The interior trim of claim 20, wherein the reformable epoxy resin adhesive is located onto or impregnated within one or more fibrous layers.