# US 2021/0197322 A1 · Method for coupling a wire to conductive fabric with low-temperature solder > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0197322 A1 - Document ID: US20210197322A1 - Status: Published application - Kind: A1 - Application number: 17/129,229 - Filed: 2020-12-21 - Published: 2021-07-01 - Earliest claimed: 2019-12-31 - Assignees: Joyson Safety Systems Acquisition LLC - Applicants: Joyson Safety Systems Acquisition LLC - Inventors: Dwayne Van'tZelfde - Web page: https://patentgrep.com/patent/US20210197322A1 ## CPC - B23K 35/264: {Bi as the principal constituent} - B23K 1/0008: {specially adapted for particular articles or work} - B23K 35/0227: {Rods or wires (B23K35/0244 takes precedence)} - B23K 2101/38: Conductors - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM ## Abstract Various implementations include a method of coupling a wire to conductive fabric. The method includes providing a conductive fabric, placing low-temperature solder in contact with a portion of the conductive fabric wherein the low-temperature solder has a liquidus temperature and a solidus temperature, placing a wire in contact with the low-temperature solder, increasing the temperature of the low-temperature solder to the liquidus temperature, and decreasing the temperature of the low-temperature solder to the solidus temperature. In some implementations, the low-temperature solder has a preformed shape corresponding to a surface of a portion of a wire, and the surface of the wire is placed in contact with the low-temperature solder. ## Claims ### Claim 1 A method of coupling a wire to conductive fabric, the method comprising: providing a conductive fabric; placing low-temperature solder in contact with a portion of the conductive fabric, wherein the low-temperature solder has a liquidus temperature and a solidus temperature; placing a wire in contact with the low-temperature solder; increasing the temperature of the low-temperature solder to the liquidus temperature; and decreasing the temperature of the low-temperature solder to the solidus temperature. ### Claim 2 (depends on 1) The method of claim 1, wherein the low-temperature solder comprises bismuth. ### Claim 3 (depends on 2) The method of claim 2, wherein the low-temperature solder comprises 50% bismuth or more by mass. ### Claim 4 (depends on 3) The method of claim 3, wherein the low-temperature solder comprises 57% bismuth, 42% tin, and 1% silver by mass. ### Claim 5 (depends on 1) The method of claim 1, wherein the liquidus temperature of the low-temperature solder is 170° C. or lower. ### Claim 6 (depends on 5) The method of claim 5, wherein the liquidus temperature of the low-temperature solder is 140° C. or lower. ### Claim 7 (depends on 1) The method of claim 1, wherein the conductive fabric comprises silver plated, knitted nylon mesh. ### Claim 8 (depends on 1) The method of claim 1, further comprising preheating the low-temperature solder before placing the low-temperature solder in contact with a portion of the conductive fabric, preheating the wire before placing the wire in contact with the low-temperature solder, or both. ### Claim 9 (depends on 1) The method of claim 1, wherein the wire comprises a terminal and the terminal is placed in contact with the low-temperature solder. ### Claim 10 (depends on 9) The method of claim 9, wherein the terminal is a spade terminal, fork terminal, or ring terminal. ### Claim 11 A method of coupling a wire to conductive fabric, the method comprising: providing a conductive fabric; placing low-temperature solder in contact with a portion of the conductive fabric, wherein the low-temperature solder has a preformed shape corresponding to a surface of a portion of a wire, wherein the low-temperature solder has a liquidus temperature and a solidus temperature; placing the surface of the wire in contact with the low-temperature solder; increasing the temperature of the low-temperature solder to the liquidus temperature; and decreasing the temperature of the low-temperature solder to the solidus temperature. ### Claim 12 (depends on 11) The method of claim 11, wherein the low-temperature solder comprises bismuth. ### Claim 13 (depends on 12) The method of claim 12, wherein the low-temperature solder comprises 50% bismuth or more by mass. ### Claim 14 (depends on 13) The method of claim 13, wherein the low-temperature solder comprises 57% bismuth, 42% tin, and 1% silver by mass. ### Claim 15 (depends on 11) The method of claim 11, wherein the liquidus temperature of the low-temperature solder is 170° C. or lower. ### Claim 16 (depends on 15) The method of claim 15, wherein the liquidus temperature of the low-temperature solder is 140° C. or lower. ### Claim 17 (depends on 11) The method of claim 11, wherein the conductive fabric comprises silver plated, knitted nylon mesh. ### Claim 18 (depends on 11) The method of claim 11, further comprising preheating the low-temperature solder before placing the low-temperature solder in contact with a portion of the conductive fabric, preheating the wire before placing the wire in contact with the low-temperature solder, or both. ### Claim 19 (depends on 11) The method of claim 11, wherein the wire comprises a terminal and the terminal is placed in contact with the low-temperature solder. ### Claim 20 (depends on 19) The method of claim 19, wherein the terminal is a spade terminal, fork terminal, or ring terminal. ### Claim 21 (depends on 19) The method of claim 19, wherein the preformed shape of the low-temperature solder corresponds to a surface of a portion of the terminal of the wire. ### Claim 22 (depends on 11) The method of claim 11, wherein the preformed shape of the low-temperature solder has a plan view surface, the shape of the plan view surface being a circle, oval, square, or rectangle.