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US 2021/0179422 A1Published application
Method for producing a micromechanical device having a damper structure
AssigneeRobert Bosch GmbH
InventorsHolger Hoefer, Klaus Offterdinger, Maximilian Amberger, Michael Stumber
Life of this patent
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Abstract
A method for producing a micromechanical device having a damper structure. The method includes: (A) providing a micromechanical wafer having a rear side; (B) applying a liquid damper material onto the rear side; (C) pressing a matrix against the rear side in order to form at least one damper structure in the damper material; (D) curing the damper material; and (E) removing the matrix.
Claims7
1-6. (canceled)
A method for producing a micromechanical device having a damper structure, the method comprising the following steps:
- (A) providing a micromechanical wafer having a rear side;
- (B) applying a liquid damper material onto the rear side;
- (C) pressing a matrix against the rear side to form at least one damper structure in the damper material;
- (D) curing the damper material;
- and
- (E) removing the matrix.
3 more elements
Dependencies are inferred from the claim text.