# US 2021/0176901 A1 · Cooling system for power modules > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0176901 A1 - Document ID: US20210176901A1 - Status: Published application - Kind: A1 - Application number: 17/108,123 - Filed: 2020-12-01 - Published: 2021-06-10 - Earliest claimed: 2019-12-06 - Assignees: Delta Electronics, Inc. - Applicants: Delta Electronics, Inc. - Inventors: Richard Hampo; Ajay Patwardhan - Web page: https://patentgrep.com/patent/US20210176901A1 ## CPC - H05K 7/20927: {Liquid coolant without phase change} - H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings} - H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A cooling system for power modules is provided. The cooling system includes two covers, a plurality of power modules and a plurality of first spaces. The power modules are disposed between the two covers. Each power module includes a housing, a circuit board and heat dissipation elements disposed on the two sides of the circuit board. There is a through hole on the housing. Each first space is formed between two neighboring power modules or is formed between the cover and the neighboring power module. The heat dissipation elements of each power module are located in the neighboring first spaces, and the through hole of each power module is in communication with the neighboring first spaces. The first spaces and the through holes of the power modules are communicated with each other to form a coolant passageway collaboratively for allowing a coolant to pass through. ## Claims ### Claim 1 A cooling system for power modules, comprising: two covers; a plurality of power modules disposed between the two covers and arranged in sequence, wherein each of the plurality of power modules comprises a housing, a circuit board and a plurality of heat dissipation elements, the circuit board is engaged in the housing, the plurality of heat dissipation elements are disposed on the two sides of the circuit board, and there is a through hole on the housing; and a plurality of first spaces, wherein each of the plurality of first spaces is formed between two neighboring power modules of the plurality of power modules or is formed between the cover and the neighboring power module, wherein the plurality of heat dissipation elements of each of the plurality of power modules are located in the neighboring first spaces, and the through hole of each of the plurality of power modules are in communication with the neighboring first spaces, wherein the plurality of first spaces and the through holes of the plurality of power modules are communicated with each other to form a coolant passageway collaboratively for allowing a coolant to pass through. ### Claim 2 (depends on 1) The cooling system according to claim 1, wherein the two covers are a top cover and a bottom cover, the top and bottom covers have a coolant outlet and a coolant inlet respectively, the coolant inlet is in communication with the first space formed between the bottom cover and the neighboring power module and is configured to introduce the coolant into the coolant passageway, and the coolant outlet is in communication with the first space formed between the top cover and the neighboring power module and is configured to release the coolant from the coolant passageway. ### Claim 3 (depends on 2) The cooling system according to claim 2, wherein centers of the two covers are both located on a first direction, and the plurality of power modules are disposed along the first direction in sequence. ### Claim 4 (depends on 3) The cooling system according to claim 3, wherein there are two through holes on the housing of each of the plurality of power modules, and the two through holes are located at two sides of the circuit board and in communication with the neighboring first spaces. ### Claim 5 (depends on 3) The cooling system according to claim 3, wherein the coolant inlet is formed on a surface parallel to the power module or a surface perpendicular to the power module, and the coolant outlet is formed on a surface parallel to the power module or a surface perpendicular to the power module. ### Claim 6 (depends on 3) The cooling system according to claim 3, wherein there is a spacer between any two neighboring power modules of the plurality of power modules, the spacer comprises two second spaces in communication with the corresponding first space, and the two second spaces are in communication with the through holes of the two neighboring power modules respectively. ### Claim 7 (depends on 3) The cooling system according to claim 3, wherein the top cover has channels for communicating the coolant outlet, the neighboring first space and the through hole of the neighboring power module with each other, and the bottom cover has channels for communicating the coolant inlet, the neighboring first space and the through hole of the neighboring power module with each other. ### Claim 8 (depends on 2) The cooling system according to claim 2, wherein centers of the two covers are both located on a first direction, and the plurality of power modules are disposed along a second direction perpendicular to the first direction in sequence. ### Claim 9 (depends on 8) The cooling system according to claim 8, further comprising a first spacer, wherein the first spacer is disposed between the top cover and the plurality of power modules, the top cover comprises a third space in communication with the coolant outlet, the first spacer has a plurality of openings corresponds to and communicates with the first spaces formed between the top cover and the plurality of power modules respectively, and the plurality of openings of the first spacer is in communication with the third space. ### Claim 10 (depends on 8) The cooling system according to claim 8, further comprising a second spacer, wherein the second spacer is disposed between the bottom cover and the plurality of power modules, the bottom cover comprises a fourth space in communication with the coolant inlet, the second spacer has a plurality of openings corresponds to and communicates with the first spaces formed between the bottom cover and the plurality of power modules respectively, and the plurality of openings of the second spacer is in communication with the fourth space. ### Claim 11 (depends on 1) The cooling system according to claim 1, wherein each of the plurality of power modules comprises power terminals which are symmetrically disposed. ### Claim 12 (depends on 1) The cooling system according to claim 1, wherein the plurality of heat dissipation elements are molded pin fins, forged pin fins, ribbon bonds, folded fins or lanced fins.