# US 2021/0175596 A1 · Integrated Heatsink and Antenna Structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0175596 A1 - Document ID: US20210175596A1 - Status: Published application - Kind: A1 - Application number: 17/110,744 - Filed: 2020-12-03 - Published: 2021-06-10 - Earliest claimed: 2019-12-09 - Assignees: Veea Inc. - Applicants: Veea Inc. - Inventors: Bob Migliorino; Michael Liccone; Shaun Joseph Greaney; Dave Doyle; Michael Mirabella; Perry Wintner; Theodore Lubbe; Clint Smith - Web page: https://patentgrep.com/patent/US20210175596A1 ## CPC - H01Q 1/02: Arrangements for de-icing; Arrangements for drying-out {; Arrangements for cooling; Arrangements for preventing corrosion} - H01Q 1/246: {specially adapted for base stations} - H01Q 1/44: using equipment having another main function to serve additionally as an antenna {, e.g. means for giving an antenna an aesthetic aspect}(H01Q1/27 - H01Q1/34 take precedence) - H01Q 9/0421: {with a shorting wall or a shorting pin at one end of the element (H01Q9/0414 takes precedence)} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract An integrated heatsink and antenna structure that is suitable for inclusion in small and midsized computing devices. The integrated heatsink and antenna structure may include heatsink portions and radio frequency antenna portions. The heatsink portions may provide a path for dissipating thermal energy or heat generated by the components in the device (e.g., printed circuit boards, processors, voltage amplifiers, etc.), and the radio frequency (RF) antenna portions may allow the device to send and receive wireless communications. The integrated heatsink and antenna structure may be formed so that radio frequency antenna portions operate to improve the thermal performance of the heatsink portions and/or so that the heatsink portions operate to improve the antenna properties (e.g., radiation patterns, radiation efficiency, bandwidth, input impedance, polarization, directivity, gain, beam-width, voltage standing wave ratio, etc.) of the radio frequency antenna portions. ## Claims ### Claim 1 A computing device comprising an integrated heatsink and antenna structure. ### Claim 2 (depends on 1) The computing device of claim 1, wherein the integrated heatsink and antenna structure is a single structure that operates as both a heat sink and a radio frequency antenna. ### Claim 3 (depends on 1) The computing device of claim 1, wherein the integrated heatsink and antenna structure comprises: a radio frequency antenna portion; and a heatsink portion, wherein the radio frequency antenna portion operates to improve the thermal performance of the heatsink portion; and wherein the heatsink portion operates to improve one or more antenna properties of the radio frequency antenna portion. ### Claim 4 (depends on 3) The computing device of claim 3, wherein the heatsink portion operates to improve one or more antenna properties of the radio frequency antenna portion by altering one or more of: radiation patterns of the radio frequency antenna portion; radiation efficiency of the radio frequency antenna portion; bandwidth of the radio frequency antenna portion; input impedance of the radio frequency antenna portion; polarization of the radio frequency antenna portion; directivity of the radio frequency antenna portion; gain of the radio frequency antenna portion; beam-width of the radio frequency antenna portion; or voltage standing wave ratio of the radio frequency antenna portion. ### Claim 5 (depends on 3) The computing device of claim 3, wherein the radio frequency antenna portion increases the heatsink surface area in the computing device and the heatsink portion extends a ground plane of the radio frequency antenna portion so as to improve the radiation patterns of the radio frequency antenna portion. ### Claim 6 (depends on 3) The computing device of claim 3, wherein the heatsink portion includes a heatsink fin that provides capacitive loading to an open end of a radiating element of radio frequency antenna portion. ### Claim 7 (depends on 1) The computing device of claim 1, wherein the integrated heatsink and antenna structure allows the computing device to send and receive wireless communications and provides a path for dissipating thermal energy or heat generated by the components in the device. ### Claim 8 (depends on 1) The computing device of claim 1, wherein the integrated heatsink and antenna structure includes one or more radio frequency antenna portions that form a planar inverted-F antenna (PIFA). ### Claim 9 (depends on 8) The computing device of claim 8, wherein the PIFA includes: a feed component; a radiating component that includes a shorted portion and a radiating portion; and a ground plane component. ### Claim 10 (depends on 9) The computing device of claim 9, wherein: the feed component engages the radiating component at a feed point; the shorted portion of the radiating component electrically shorts one end of the radiating component to the ground component; and the ground plane component is coupled to a heatsink fin. ### Claim 11 (depends on 1) The computing device of claim 1, wherein the integrated heatsink and antenna structure includes one or more radio frequency antenna portions that form a monopole antenna. ### Claim 12 (depends on 1) The computing device of claim 1, wherein the integrated heatsink and antenna structure includes a ground plane independent design (e.g. dipole) that uses use a heatsink portion of the integrated heatsink and antenna structure as a pattern shaping element (e.g. dish of a dish antenna, etc.) for a radio frequency antenna portion of the integrated heatsink and antenna structure. ### Claim 13 (depends on 1) The computing device of claim 1, wherein all or portions of the integrated heatsink and antenna structure are made of aluminum or copper. ### Claim 14 (depends on 1) The computing device of claim 1, wherein the integrated heatsink and antenna structure includes four side surfaces and four side corner edges, and includes a frequency antenna portion at each of the four side corner edges. ### Claim 15 (depends on 14) The computing device of claim 14, wherein the integrated heatsink and antenna structure further includes a frequency antenna portion on each of the side surfaces. ### Claim 16 (depends on 14) The computing device of claim 14, wherein the integrated heatsink and antenna structure further includes a grounding plate on each of the side surfaces. ### Claim 17 An integrated heatsink and antenna structure, comprising: a radio frequency antenna portion; and a heatsink portion, wherein the radio frequency antenna portion operates to improve the thermal performance of the heatsink portion; and wherein the heatsink portion operates to improve one or more antenna properties of the radio frequency antenna portion. ### Claim 18 (depends on 17) The integrated heatsink and antenna structure of claim 17, wherein the heatsink portion operates to improve one or more antenna properties of the radio frequency antenna portion by altering one or more of: radiation patterns of the radio frequency antenna portion; radiation efficiency of the radio frequency antenna portion; bandwidth of the radio frequency antenna portion; input impedance of the radio frequency antenna portion; polarization of the radio frequency antenna portion; directivity of the radio frequency antenna portion; gain of the radio frequency antenna portion; beam-width of the radio frequency antenna portion; or voltage standing wave ratio of the radio frequency antenna portion. ### Claim 19 (depends on 17) The integrated heatsink and antenna structure of claim 17, wherein: the radio frequency antenna portion increases the heatsink surface area of the integrated heatsink and antenna structure; and the heatsink portion improves the radiation patterns of the radio frequency antenna portion by extending a ground plane of the radio frequency antenna portion. ### Claim 20 A quantum computing device comprising an integrated heatsink and antenna structure that operates as both a heat sink and a radio frequency antenna, the integrated heatsink and antenna structure comprising: a radio frequency antenna portion; and a heatsink portion, wherein the radio frequency antenna portion increases the heatsink surface area of the integrated heatsink and antenna structure; and wherein the heatsink portion improves the radiation patterns of the radio frequency antenna portion by extending a ground plane of the radio frequency antenna portion.