# US 2021/0175293 A1 · Electronic panel and method for manufacturing the same

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- Number: US 2021/0175293 A1
- Document ID: US20210175293A1
- Status: Published application
- Kind: A1
- Application number: 17/182,042
- Filed: 2021-02-22
- Published: 2021-06-10
- Earliest claimed: 2018-09-04
- Assignees: Samsung Display Co., Ltd.
- Applicants: Samsung Display Co., Ltd.
- Inventors: Ji-hyun KIM; Junhong PARK; Jun CHUN; Euisuk JUNG; Hoon KANG; Jeongmin PARK
- Web page: https://patentgrep.com/patent/US20210175293A1

## CPC

- G06F 3/0443: {using a single layer of sensing electrodes}
- G06F 3/0412: {Digitisers structurally integrated in a display}
- G06F 3/044: by capacitive means
- H10K 59/124: Insulating layers formed between TFT elements and OLED elements
- H10K 59/35: comprising red-green-blue [RGB] subpixels
- H10K 59/40: OLEDs integrated with touch screens
- H10K 59/876: {comprising a resonant cavity structure, e.g. Bragg reflector pair}
- H10K 71/621: {Providing a shape to conductive layers, e.g. patterning or selective deposition}
- G06F 2203/04111: Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
- G06F 2203/04112: Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
- H10D 99/00: Subject matter not provided for in other groups of this subclass
- H10K 59/131: Interconnections, e.g. wiring lines or terminals
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES

## Abstract

An electronic device includes an electronic panel including an active area and a pad area and including an input sensing member and a circuit board overlapping at least a side of the pad area. The electronic panel includes a first conductive layer, a second conductive layer, a first organic insulation layer disposed between the first conductive layer and the second conductive layer, a pattern layer disposed on the second conductive layer, overlapping the plurality of second conductive patterns, and including a plurality of organic patterns, and a second organic insulation layer covering the pattern layer and the second conductive layer. The pattern layer covers an upper surface of the second conductive layer.

## Claims

### Claim 1

A method for manufacturing an electronic panel, the method comprising:
forming first conductive patterns on a base substrate;
forming a first organic insulation layer covering the first conductive patterns;
forming a preliminary conductive layer on the first organic insulation layer;
forming a preliminary pattern layer on the preliminary conductive layer;
etching the preliminary pattern layer by using a first mask to form a plurality of organic patterns;
patterning the preliminary conductive layer by using the plurality of organic patterns as a second mask to form second conductive patterns; and
forming a second organic insulation layer on the second conductive patterns,
wherein the plurality of organic patterns are made of the same material as the second organic insulation layer.

### Claim 2 (depends on 1)

The method of claim 1, after the forming of the plurality of organic patterns, further comprising etching a portion of the plurality of organic patterns by using the first mask and the second mask to expose a top surface of each of the second conductive patterns that overlaps the portion of the plurality of organic patterns that is etched.

### Claim 3 (depends on 1)

The method of claim 1, wherein the second organic insulation layer covers top surfaces of the plurality of organic patterns and a top surface of the first organic insulation layer that is exposed by the plurality of organic patterns.