# US 2021/0175221 A1 · Photorelay

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- Number: US 2021/0175221 A1
- Document ID: US20210175221A1
- Status: Published application
- Kind: A1
- Application number: 17/012,487
- Filed: 2020-09-04
- Published: 2021-06-10
- Earliest claimed: 2019-12-04
- Assignees: Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation
- Applicants: Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation
- Inventors: Tatsuo Tonedachi
- Web page: https://patentgrep.com/patent/US20210175221A1

## CPC

- H10W 90/00: Package configurations
- H03K 17/785: controlling field-effect transistor switches
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/695: Organic materials
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/926: {Multiple bond pads having different sizes}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/732: {between stacked chips}
- H10W 90/753: {between laterally-adjacent chips}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H03K: PULSE TECHNIQUE (measuring pulse characteristics G01R; modulating sinusoidal oscillations with pulses H03C; transmission of digital information H04L; discriminator circuits detecting phase difference between two signals by counting or integrating cycles of oscillation H03D3/04; automatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses where the type of generator is irrelevant or unspecified H03L; coding, decoding or code conversion, in general H03M)

## Abstract

A photorelay of an embodiment includes a polyimide substrate having a first surface and a second surface on an opposite side of the polyimide substrate from the first surface, the polyimide substrate having a thickness equal to or more than 10 μm and equal to or less than 120 μm, an input terminal provided on the second surface, an output terminal provided on the second surface, a light receiving element provided on the first surface, a light emitting element provided on the light receiving element, and a MOSFET provided on the first surface.

## Claims

### Claim 1

A photorelay comprising:
a polyimide substrate having a first surface and a second surface on an opposite side of the polyimide substrate from the first surface, the polyimide substrate having a thickness equal to or more than 10 μm and equal to or less than 120 μm;
an input terminal provided on the second surface;
an output terminal provided on the second surface;
a light receiving element provided on the first surface;
a light emitting element provided on the light receiving element; and
a MOSFET provided on the first surface.

### Claim 2 (depends on 1)

The photorelay according to claim 1, wherein
the polyimide substrate has a thickness equal to or more than 10 μm and equal to or less than 100 μm.

### Claim 3 (depends on 1)

The photorelay according to claim 1, wherein
the input terminal and the output terminal have a thickness equal to or more than 5 μm and equal to or less than 20 μm.

### Claim 4 (depends on 1)

The photorelay according to claim 1, wherein
the output terminal is connected to the MOSFET via at least one via wiring provided through the polyimide substrate, the via wiring having a diameter equal to or more than 20 μm and equal to or less than 150 μm.

### Claim 5 (depends on 1)

The photorelay according to claim 1, wherein
the polyimide substrate has a thickness equal to or more than 10 μm and equal to or less than 60 μm.

### Claim 6 (depends on 1)

The photorelay according to claim 1, wherein
the polyimide substrate has a thickness equal to or more than 10 μm and equal to or less than 30 μm.