# US 2021/0175162 A1 · Secure semiconductor integration > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0175162 A1 - Document ID: US20210175162A1 - Status: Published application - Kind: A1 - Application number: 17/180,835 - Filed: 2021-02-21 - Published: 2021-06-10 - Earliest claimed: 2011-07-27 - Assignees: BroadPak Corporation - Applicants: BroadPak Corporation - Inventors: Farhang YAZDANI - Web page: https://patentgrep.com/patent/US20210175162A1 ## CPC - H10W 70/635: {Through-vias} - H10W 40/47: by flowing liquids, e.g. forced water cooling - H10W 42/40: protecting against tampering, e.g. unauthorised inspection or reverse engineering - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 70/095: {of vias therein} - H10W 70/65: Shapes or dispositions of interconnections - H10W 72/071: {Connecting or disconnecting} - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 76/12: characterised by their shape - H10W 90/00: Package configurations - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W 44/248: {for antennas} - H10W 44/251: {for monolithic microwave integrated circuits [MMIC]} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/682: {comprising holes having chips therein} - H10W 72/01: {Manufacture or treatment} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 72/823: {Interconnections through encapsulations, e.g. pillars through molded resin on a lateral side a chip} - H10W 80/334: {Thermocompression bonding} - H10W 90/22: the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL - H10W 90/297: {characterised by the through-semiconductor vias [TSVs] in the stacked chips} - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/792: {between multiple chips} - H10W 90/794: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y10T 29/53174: Means to fasten electrical component to wiring board, base, or substrate - Y10T 29/53178: Chip component - Y10T 29/53183: Multilead component - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A system comprising a plurality of electronic components, wherein said plurality of electronic components including a first component and a second component, and said first component is a security component configured to generate and/or store security key(s); a substrate; one or more standoff substrate(s) comprising of cavity(3ies), wherein said one or more standoff substrate(s) is/are coupled to said substrate, said one or more standoff substrate(s) completely encircles said substrate, said security component is disposed inside said cavity(ies), said security component is coupled to said substrate, said security component is obfuscated by said substrate and said one or more standoff substrate(s), and said security component and said second component are configured to communicate security key(s) for performing device identification, authentication, encryption, and/or device integrity verification. ## Claims ### Claim 1 A system comprising: a plurality of components, wherein said plurality of components including a first component and a second component, and said first component is a security component configured to generate and/or store security key(s); a substrate; one or more standoff substrate(s) comprising of cavity(ies), wherein said one or more standoff substrate(s) is/are coupled to said substrate, said one or more standoff substrate(s) completely encircles said substrate, said security component is disposed inside said cavity(ies), said security component is coupled to said substrate, said security component is obfuscated by said substrate and/or said one or more standoff substrate(s) to minimize tampering, and said security component and said second component are configured to communicate security key(s) for performing device identification, authentication, encryption, and/or device integrity verification. ### Claim 2 (depends on 1) A system according to claim 1, wherein one of said plurality of components is configured to perform tamper detection. ### Claim 3 (depends on 1) A system according to claim 1, wherein one of said plurality of components disposed inside said cavity(ies) is a power (voltage) regulator. ### Claim 4 (depends on 1) A system according to claim 1, wherein said the one standoff substrate doesn't encircle said substrate(s). ### Claim 5 (depends on 1) A system according to claim 1, wherein said one or more standoff substrate(s) are spaced apart. ### Claim 6 (depends on 1) A system according to claim 1, wherein said substrate(s) comprises of one or more cavity(ies). ### Claim 7 (depends on 1) A system according to claim 1, wherein said substrate(s) and/or standoff substrate(s) comprises of anti-tamper mesh. ### Claim 8 (depends on 1) A system according to claim 1, wherein said substrate(s) and/or standoff substrate(s) comprises of molding compound. ### Claim 9 (depends on 1) A system according to claim 1, wherein one of said plurality of the components is a power management/regulator or security sub-circuit or tamper detect circuit or router or switch or antenna or radar or phased array or modem or baseband or transceiver or mm-wave subsystem or silicon-on-insulator or amplifier or Field Programmable Gate Array (FPGA) or capacitor or resistor or inductor or processor or memory or sensor or analog-to-digital converter or digital-to-analog converter or electrical-optical converter or optical-electrical converter or Light Emitting Diode (LED) or Application-Specific Integrated Circuit (ASIC) or Through-Silicon Via (TSV) or laser or analog circuit or digital circuit or Serializer/Deserializer (SerDes) or filter or Lens or Graphics Processing Unit (GPU) or magnet or waveguide or wirebond or epoxy mold compound (EMC) or under-fill material or heat-pipe or mirror or fan or bump or fiber or accelerator/co-processor or processor core or Microelectromechanical Systems (MEMS) or membrane or heat spreader or energy source or sensing material or piezoelectric or light source or touch screen or Liquid Crystal Display (LCD) or organic light-emitting diode (OLED) or battery or Electromagnetic Shield (EMI) coating. ### Claim 10 A system comprising: a plurality of components, wherein said plurality of components including a first component and a second component, and said first component is a security component configured to generate and/or store security key(s); a first substrate; a second substrate; one or more standoff substrate(s) comprising of cavity(ies), wherein said one or more standoff substrate(s) is/are coupled to said first substrate and said second substrate, said one or more standoff substrate(s) completely encircles said first substrate and/or said second substrate, said security component is disposed inside said cavity(ies), said security component is coupled to said first substrate and/or said second substrate, said security component is obfuscated by said first substrate and/or said second substrate and/or said one or more standoff substrate(s) to minimize tampering, said second component is coupled to said first substrate and/or said second substrate, said second component is configured to communicate with said security component, and said security component and said second component are configured to communicate security key(s) for performing device identification, authentication, encryption, and/or device integrity verification. ### Claim 11 (depends on 10) A system according to claim 10, wherein one of said plurality of components is configured to perform tamper detection. ### Claim 12 (depends on 10) A system according to claim 10, wherein one of said plurality of components disposed inside said cavity(ies) is a power (voltage) regulator. ### Claim 13 (depends on 10) A system according to claim 10, wherein said the one standoff substrate doesn't encircle said first substrate and/or said second substrate. ### Claim 14 (depends on 10) A system according to claim 10, wherein said one or more standoff substrate(s) are spaced apart. ### Claim 15 (depends on 10) A system according to claim 10, wherein said first substrate and/or said second substrate comprises of one or more cavity(ies). ### Claim 16 (depends on 10) A system according to claim 10, wherein said first substrate and/or said second substrate and/or said standoff substrate(s) comprises of anti-tamper mesh. ### Claim 17 (depends on 10) A system according to claim 10, wherein said first substrate and/or said second substrate and/or said standoff substrate(s) comprises of molding compound. ### Claim 18 (depends on 10) A system according to claim 10, wherein one of said plurality of the components is a power management/regulator or security sub-circuit or tamper detect circuit or router or switch or antenna or radar or phased array or modem or baseband or transceiver or mm-wave subsystem or silicon-on-insulator or amplifier or Field Programmable Gate Array (FPGA) or capacitor or resistor or inductor or processor or memory or sensor or analog-to-digital converter or digital-to-analog converter or electrical-optical converter or optical-electrical converter or Light Emitting Diode (LED) or Application-Specific Integrated Circuit (ASIC) or Through-Silicon Via (TSV) or laser or analog circuit or digital circuit or Serializer/Deserializer (SerDes) or filter or Lens or Graphics Processing Unit (GPU) or magnet or waveguide or wirebond or epoxy mold compound (EMC) or under-fill material or heat-pipe or mirror or fan or bump or fiber or accelerator/co-processor or processor core or Microelectromechanical Systems (MEMS) or membrane or heat spreader or energy source or sensing material or piezoelectric or light source or touch screen or Liquid Crystal Display (LCD) or organic light-emitting diode (OLED) or battery or Electromagnetic Shield (EMI) coating. ### Claim 19 A system comprising: a plurality of components, wherein said plurality of components including a first component and a second component, and said first component is a security component configured to generate and/or store security key(s); a first substrate; a second substrate, wherein said second substrate comprising cavity(ies); and one or more standoff substrate(s), wherein said one or more standoff substrate comprising said cavity(ies), said security component is disposed inside said second substrate cavity(ies), said second substrate is coupled to said first substrate, said one or more standoff substrate(s) is/are coupled to said first substrate and/or said second substrate, said one or more standoff substrate(s) completely encircles said first substrate and/or said second substrate, said security component is obfuscated by said first substrate and/or said second substrate and/or said one or more standoff substrate(s) to minimize tampering, said second component is coupled to said first substrate or said second substrate, said second component is configured to communicate with said security component, and said security component and said second component are configured to communicate security key(s) for performing device identification, authentication, encryption, and/or device integrity verification. ### Claim 20 (depends on 19) A system according to claim 19, wherein one of said plurality of components is configured to perform tamper detection. ### Claim 21 (depends on 19) A system according to claim 19, wherein one of said plurality of components disposed inside said cavity(ies) is a power (voltage) regulator. ### Claim 22 (depends on 19) A system according to claim 19, wherein said the one standoff substrate doesn't encircle said first substrate and/or said second substrate. ### Claim 23 (depends on 19) A system according to claim 19, wherein said one or more standoff substrate(s) are spaced apart. ### Claim 24 (depends on 19) A system according to claim 19, wherein said first substrate and/or said second substrate comprises of one or more cavity(ies). ### Claim 25 (depends on 19) A system according to claim 19, wherein said first substrate and/or said second substrate and/or said standoff substrate(s) comprises of anti-tamper Redistribution layer(s). ### Claim 26 (depends on 19) A system according to claim 19, wherein said first substrate and/or said second substrate and/or said standoff substrate(s) comprises of molding compound. ### Claim 27 (depends on 19) A system according to claim 19, wherein one of said plurality of the components is a power management/regulator or security sub-circuit or tamper detect circuit or router or switch or antenna or radar or phased array or modem or baseband or transceiver or mm-wave subsystem or silicon-on-insulator or amplifier or Field Programmable Gate Array (FPGA) or capacitor or resistor or inductor or processor or memory or sensor or analog-to-digital converter or digital-to-analog converter or electrical-optical converter or optical-electrical converter or Light Emitting Diode (LED) or Application-Specific Integrated Circuit (ASIC) or Through-Silicon Via (TSV) or laser or analog circuit or digital circuit or Serializer/Deserializer (SerDes) or filter or Lens or Graphics Processing Unit (GPU) or magnet or waveguide or wirebond or epoxy mold compound (EMC) or under-fill material or heat-pipe or mirror or fan or bump or fiber or accelerator/co-processor or processor core or Microelectromechanical Systems (MEMS) or membrane or heat spreader or energy source or sensing material or piezoelectric or light source or touch screen or Liquid Crystal Display (LCD) or organic light-emitting diode (OLED) or battery or Electromagnetic Shield (EMI) coating. ### Claim 28 (depends on 24) A system according to claim 24, wherein said one or more standoff substrate(s) is/are coupled to said one or more cavity(ies) of said first substrate and/or said second substrate. ### Claim 29 (depends on 15) A system according to claim 15, wherein said one or more standoff substrate(s) is/are coupled to said one or more cavity(ies) of said first substrate and/or said second substrate. ### Claim 30 (depends on 6) A system according to claim 6, wherein said one or more standoff substrate(s) is/are coupled to said substrate cavity(ies).