# US 2021/0172084 A1 · Method for reproducing plating solution

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- Number: US 2021/0172084 A1
- Document ID: US20210172084A1
- Status: Published application
- Kind: A1
- Application number: 17/081,547
- Filed: 2020-10-27
- Published: 2021-06-10
- Earliest claimed: 2019-12-05
- Assignees: C. Uyemura & Co., Ltd.
- Applicants: C. Uyemura & Co., Ltd.
- Inventors: Daisuke HASHIMOTO; Masayuki KISO; Akira OKADA; Hironori SUGIURA; Toshikazu KANO; Keita TANIGUCHI
- Web page: https://patentgrep.com/patent/US20210172084A1

## CPC

- C25D 7/00: Electroplating characterised by the article coated
- C25D 21/16: Regeneration of process solutions
- C25D 3/30: of tin
- C25D 3/32: characterised by the organic bath constituents used
- C25D 3/60: containing more than 50% by weight of tin
- C25D 21/18: of electrolytes (C25D21/22 takes precedence)
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR

## Abstract

A plating solution containing a leveler is brought into contact with silica particles with an average particle diameter of 500 μm or less to remove impurities from the plating solution.

## Claims

### Claim 1

A method for reproducing a plating solution comprising:
bringing a plating solution containing a leveler into contact with silica particles with an average particle diameter of 500 μm or less to remove impurities from the plating solution.

### Claim 2 (depends on 1)

The method of claim 1, wherein the plating solution is circulated from a plating tank containing the plating solution and the plating solution from which the impurities are removed by the circulation is returned to the plating tank.

### Claim 3 (depends on 1)

The method of claim 1, wherein the silica particles are contained in an impurity removing device disposed in a circulating path for the plating solution.

### Claim 4 (depends on 3)

The method of claim 3, wherein the impurity removing device is a bag filter.

### Claim 5 (depends on 4)

The method of claim 4, wherein an average particle diameter of the silica particles is larger than an opening of the bag filter.

### Claim 6 (depends on 1)

The method of claim 1, wherein the plating solution is an electrolytic tin plating solution or an electrolytic tin alloy plating solution.

### Claim 7 (depends on 1)

The method of claim 1, wherein the leveler is indole.